20" x 20" Panel Size Glass IPD Interposer Manufacturing

Chen, Yuhua; Chien, Chun-Hsien; Hsieh, Yu-Chung; Lin, Wei-Ti; Yeh, Wen-Liang; Chen, Chien‐Chou; Tseng, Tzvy-Jang; Yun, Hobie

doi:10.1109/ectc.2016.400

Cited by 9 publications

(2 citation statements)

References 7 publications

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“…Glass as a substrate material has several merits, namely: high resistivity, a low dielectric loss at high frequency, adjustability in material properties especially coefficient of thermal expansion, and simple manufacturing process resulting from no need of an insulation layer. Additionally, a glass substrate can be processed in large panel sizes and has been recently proposed as a superior alternative to address the limitations of organic and silicon based interposers [1][2][3][4][5]. Based on these attributes, TGV interposer technology has emerged as a promising technology for 2.5D/3D RF integration.…”

Section: Introductionmentioning

confidence: 99%

“…TGVs with 100 µm pitch and high aspect ratio are formed using a method called focused electrical discharging method in thick glass substrates, the method has achieved high throughput [14]. Studies have reported a pitch of 30 µm and a height of less than 200 µm for a TGV sample fabricated by laser drilling [1,[17][18][19][20]. A novel photosensitive glass, patterned by photolithography and followed by wet chemical etching process is reported, the TGVs with a diameter of 20 µm and a 4:1 aspect ratio is demonstrated [18].…”

Section: Introductionmentioning

confidence: 99%

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Design, fabrication, and radio frequency property evaluation of a through-glass-via interposer for 2.5D radio frequency integration

Cai

Yan

et al. 2019

J. Micromech. Microeng.

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In this paper, a through-glass-via (TGV) interposer for 2.5D radio frequency (RF) integration is presented. A coplanar waveguide (CPW) transmission line with grounded TGVs on one side interconnects with the mounted RF devices, and an electrical ground plane on the other side. Tapered TGVs are fabricated using a combined method of sandblasting and thinning/polishing process to achieve precise control of the profile of the vias and improve uniformity. The TGVs are metalized by conformal copper (Cu) electroplating to form a vertical interconnection between the upper and lower metal layers, which can maintain RF performance and avoid thermal stress issues. The CPW transmission lines with electrically grounded TGVs and test structures are designed, fabricated and tested to evaluate the TGV's RF performance and suitability for 2.5D RF integration. The RF measurements show that the insertion loss is about 0.13 dB mm −1 @10 GHz for the CPW line with grounded TGV which is less than 0.1 dB@10 GHz for a single TGV. We analyzed S parameter for the tests and simulations when taking into account various factors in the manufacturing process, such as the surface roughness and metal resistivity. The results provide a research direction for the optimization of the parameters in the follow-up study. In addition, a 2.5D RF receiver module based on the proposed TGV interposer in the L-band is assembled and validated. The gain value of the TGV interposer integrated RF module is about 14.4 dB, which is close to the theoretical value.

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