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Although Silicon interposer has good performance, however high cost is still the major issue and limits its high volume adoption. Therefore to decrease the assembly cost or develop low cost, high density interconnect interposer technology is the keys to enable 2.5D SiP integration. One possibility is to develop low cost interposer by adopting the alternative materials instead of Silicon. The glass, low CTE polymer material, ceramic, etc. may be included. Glass represents an attractive choice with potential of tailorable properties dependent on specific glass composition. By targeting the coefficient of thermal expansion (CTE), the CTE of glass can be made to match perfectly with silicon dies and for reliable package. In addition, the advantages of using glass for interposer derive from process flexibility for size and thickness since the glass fusion process provides sheets with dimensions of more than three meters. It is straight forward to provide glass substrate of almost any size needed. Large glass panels are ideally suited for fabrication of interposer where the panel process is expected to provide large number of interposers in each run compared with wafer processing. Additionally, the two sided processing of the panel, the avoidance of Si wafer CMP processes further enable lower unit cost for the interposer Consequently, glass is an ideal interposer material due to its insulating property, large panel size availability, high modulus and ability to tailor CTE. In this paper, we successfully demonstrate manufacturing feasibility of glass substrate with 4 build-up layers starting with a thin glass panel in 508mm×508mm panel size format and under the IC substrate manufacturing environment. Glass thickness of 100~300um could be processed through the IC substrate HVM line. The laser via in via or direct metallization technology could be selected for double side electrical connection. The copper line width/space of 8/8um was demonstrated by current substrate HVM line. By adopting advanced lithography process and material, line width/space less than 2/2um was achievable. TCT Reliability test without glass crack results will also be discussed.

This paper aims to discuss the integration of 3D solenoid inductors fabricated by using a glass core substrate with through glass via (TGV) technology. Glass materials were chosen for the substrate core based on the natural properties of low insertion loss, adjustable CTE, low surface roughness and high insulation for RF application. The TGV formation and semi-additive conformal copper electroplating were the key processes of the glass core substrate manufacturing. The key benefits of these evaluations are a competitive cost structure for a 508mm × 508mm glass panel IC (integrated circuit) substrate HVM (high volume manufacture) line. The characterization results of TGV formation, the process flow of 3D solenoid inductor glass core substrate and real silicon device chips assembled on the top of glass core substrate were also investigated and discussed.

The rapidly growing concern about environmental and resource protection have stimulatedmany industrial sectors to solve the disposal problems of used products. The recovery processes canbe simply categorized into material recovery and product/component recovery. Material recoverymostly involves disassembly for separation and processing of materials of used products. Destructive methods such as dismantling, shredding, or chemical operations are normally used. Product recoveryincludes disassembly, cleaning, sorting, replacing or repairing bad components, reconditioning,testing, reassembling and inspecting. These recovered components/products can be reused inrepairing and re-manufacturing. That provides an opportunity in bringing the used products back to an “as new” condition. This paper utilizes the concept of non-destructive method of product recovery processes and develops an automatic disassembly system for white board marker pens. The experimental results show that the cycle time for the disassembly processes is about 3.8 second that is believed to be compatible to the desired feeding rate for manufacturing. In addition, the reused rate for the recovered components is close to 100% except the fiber-refill component.