21.3: Flexible Color AM‐OLED Display Fabricated Using Surface Free Technology by Laser Ablation/Annealing (SUFTLA®) and Ink‐jet Printing Technology

Utsunomiya, Sumio; Kamakura, Tomoyuki; Kasuga, Masashi; Kimura, Mutsumi; Miyazawa, Wakao; Inoue, Satoshi; Shimoda, Tatsuya

doi:10.1889/1.1832407

Cited by 46 publications

(24 citation statements)

References 13 publications

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“…The first (and so far most complex) thin-film flexible microprocessor was published in 2005 3 . It comprises ~32,000 transistors based on flexible complementary LTPS transistors, which are released from the carrier by employing the 'surface-free technology by laser ablation/annealing' process flow 47 . The first unipolar organic microprocessor fabricated directly on flexible substrates exhibited a clock frequency of 40 Hz to execute 8-bit operations 48 .…”

Section: Towards Vlsi (Digital) Circuits On Foilmentioning

confidence: 99%

The development of flexible integrated circuits based on thin-film transistors

2018

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T hin-film transistors (TFTs) are currently the dominant technology for in-pixel switches and drivers in flat-panel displays. Trends in consumer electronics demand ever-higher display resolution and brightness, lower power consumption, and new features and form factors (such as curved and foldable displays). This drives TFT devices to deliver more complex functions than simply switching. For example, recent bezel-less displays delegate the task of row selection to TFT circuits integrated next to the pixel array. Such driver circuits comprise thousands of switches operating together -previously a job for silicon chips mounted around the display.Beyond displays, how far can thin-film circuits go in terms of replacing silicon complementary metal-oxide-semiconductor (CMOS) chips? Fig. 1 illustrates the key advantages of thin-film circuits on flexible substrates. The circuits can be fabricated on large substrates, thereby creating very thin, lightweight and ultra-flexible electronics 1,2 . Folding, rolling or crumpling such flexible circuits is possible without destroying the electronic functionality. Because of these properties, a flexible TFT-based microprocessor 3 (Fig. 1d) or thin-film near-field communication (NFC) tag (Fig. 1e) can, for example, be integrated imperceptibly into any object. TFT technologies also have considerable potential for fabrication on ultrathin stretchable substrates 4 that can be made porous to create breathable devices for contact with skin. With these features, thin-film integrated circuits (ICs) could be a game-changer for wearable electronics. Ultrathin, conformable ICs in the form of a tattoo could be used to monitor vital body parameters, communicating these parameters directly to a patient's smartphone or a medical database.In this Perspective, I discuss the potential of thin-film circuits on plastic substrates for the development of Internet of Things (IoT) and wearable applications. First I look at the different TFT technologies that can be realized on flexible substrates, and then discuss the impact TFT technology will have on circuit design at the level of digital logic gates and very-large-scale integration (VLSI) digital circuits. For the latter, I consider the use of thin-film ICs in the creation of low-cost radiofrequency identification (RFID) tags for everyday items. Flexible chips may initially be used to simply identify each item. Then, when the RFID chip is potentially replaced with a thinfilm NFC chip, standard smartphones and tablets equipped with NFC readers could identify objects and connect them to the cloud. Another advantage of thin-film IC technology is its potential to be combined with sensor or signage technology, thereby integrating more functionality into the objects, which is discussed in a section on analogue circuits. Finally, I will briefly examine the potential of silicon CMOS chip technology to be interfaced directly with TFT circuitry. TFT technologyThe development and optimization of transistor technologies are driven by four important figures of me...

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Section: Towards Vlsi (Digital) Circuits On Foilmentioning

confidence: 99%

The development of flexible integrated circuits based on thin-film transistors

2018

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“…Another category of flexible backplane is referred to as "transfer" technology. [18][19][20] By decoupling the backplane process from the final flexible substrates, it has the advantage of being able to apply existing Si technology (on glass) to many flexible substrate materials. However, the yield and scalability of this technology remain to be seen.…”

Section: Active-matrix Backplanesmentioning

confidence: 99%

Flexible active‐matrix OLED displays: Challenges and progress

Hewitt

Rajan

et al. 2008

J Soc Info Display

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Abstract— Organic light‐emitting‐device (OLED) devices are very promising candidates for flexible‐display applications because of their organic thin‐film configuration and excellent optical and video performance. Recent progress of flexible‐OLED technologies for high‐performance full‐color active‐matrix OLED (AMOLED) displays will be presented and future challenges will be discussed. Specific focus is placed on technology components, including high‐efficiency phosphorescent OLED technology, substrates and backplanes for flexible displays, transparent compound cathode technology, conformal packaging, and the flexibility testing of these devices. Finally, the latest prototype in collaboration with LG. Phillips LCD, a flexible 4‐in. QVGA full‐color AMOLED built on amorphous‐silicon backplane, will be described.

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“…Although its basic display functions were successfully demonstrated, the AM-LCD panel suffered from numerous line defects that occurred during the transfer process and the assembling process. However, as the transfer technique improved and matured, the defect rate drastically decreased and we succeeded to develop various display devices such as AM-OLEDs [11][12] and AM-EPDs [3][4][5]. In addition to displays, we have also applied SUFTLA to other kinds of electronic devices such as asynchronous 8-bit CPUs [13], SRAMs [14] and fingerprint sensors [15].…”

Section: Suftla Processesmentioning

confidence: 99%

62.2: A Flexible 7.1-in. Active-Matrix Electrophoretic Display

Komatsu

Kawai

Kodaira

et al. 2006

SID Symposium Digest

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We have developed a flexible 7.1‐inch Quad‐XGA active‐matrix electrophoretic display using SUFTLA™. The whole panel circuitry including 7.3‐milion transistors was successfully transferred onto a plastic substrate without damage. Integrating both scan‐ and data‐drivers made it possible that 3‐mega pixels are controlled with only 40 signal terminals. The developed panel fulfills major requirements for e‐paper including true flexibility, thinness and lightness.

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21.3: Flexible Color AM‐OLED Display Fabricated Using Surface Free Technology by Laser Ablation/Annealing (SUFTLA®) and Ink‐jet Printing Technology

Cited by 46 publications

References 13 publications

The development of flexible integrated circuits based on thin-film transistors

The development of flexible integrated circuits based on thin-film transistors

Flexible active‐matrix OLED displays: Challenges and progress

62.2: A Flexible 7.1-in. Active-Matrix Electrophoretic Display

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