3-Axis fully-integrated surface-mountable differential capacitive tactile sensor by CMOS flip-bonding

Asano, Sho; Muroyama, Masanori; Bartley, Travis; Nakayama, Takahiro; Yamaguchi, Ui; Yamada, Hitoshi; Hata, Yoshiyuki; Nonomura, Yutaka; Tanaka, Shuji

doi:10.1109/memsys.2016.7421763

Cited by 13 publications

(5 citation statements)

References 7 publications

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“…Figure 18 shows an image of a triaxial tactile sensor chip, in which an MEMS sensor element is mounted on the nerve‐net chip and integrated into the sensor chip. The sensor chip is mounted on a serial line [35–50]. The cross‐sectional structure of the tactile sensor chip integrated with the nerve‐net chip is shown in Fig.…”

Section: Sensors For Robotsmentioning

confidence: 99%

Sensor Technologies for Automobiles and Robots

Nonomura

2020

IEEJ Transactions Elec Engng

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This paper reviews various sensor technologies with application in automobiles and robots. Several automotive sensors have been developed using the micro‐electromechanical systems (MEMS) technology. The technologies related to combustion pressure sensors, yaw rate sensors, acceleration sensors, and optical scanners are described here. The combustion pressure sensors are used for engine control, while the yaw rate sensors of quartz and silicon crystals and the acceleration sensors are applied for vehicle motion control. Optical scanners are developed for autonomous driving. Several automotive sensors have been significantly reduced in size and cost, and their performance has been improved dramatically by MEMS technology. The inertial force‐sensing system with yaw rate and acceleration sensors enabled the assistant and partner robots to stand on two legs, walk, or invert and move on two wheels. Because the robots are required to have a variety of sensors, a nerve‐net sensing system was developed. This sensing system has three layers: the host, relay, and sensor nodes. The sensor node is a special large‐scale integration called a ‘nerve‐net chip.’ A triaxial force tactile sensor integrated with the nerve‐net chip was developed as a 2.8‐mm square surface‐mountable chip. A force and thermal tactile sensor was also developed, which detected heat flows and discriminated the materials of contacted objects. The heat flow sensor was thinned with thin‐film technology. The sensor technologies will be used for eco cars and autonomous vehicles. Next‐generation robots are also supported by several automotive sensor technologies. © 2020 Institute of Electrical Engineers of Japan. Published by John Wiley & Sons, Inc.

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Section: Sensors For Robotsmentioning

confidence: 99%

Sensor Technologies for Automobiles and Robots

Nonomura

2020

IEEJ Transactions Elec Engng

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“…It is challenging and satisfying both the sensor–electronics fusion and an advanced packaging at the same time has barely been studied. Our previous studies revealed that the critical factors for the successful prototyping are the design of a chip structure and a manufacturing process [ 3 , 4 , 5 , 6 ].…”

Section: Introductionmentioning

confidence: 99%

Design and Fabrication Technology of Low Profile Tactile Sensor with Digital Interface for Whole Body Robot Skin

Makihata

Muroyama

Tanaka

et al. 2018

Sensors

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Covering a whole surface of a robot with tiny sensors which can measure local pressure and transmit the data through a network is an ideal solution to give an artificial skin to robots to improve a capability of action and safety. The crucial technological barrier is to package force sensor and communication function in a small volume. In this paper, we propose the novel device structure based on a wafer bonding technology to integrate and package capacitive force sensor using silicon diaphragm and an integrated circuit separately manufactured. Unique fabrication processes are developed, such as the feed-through forming using a dicing process, a planarization of the Benzocyclobutene (BCB) polymer filled in the feed-through and a wafer bonding to stack silicon diaphragm onto ASIC (application specific integrated circuit) wafer. The ASIC used in this paper has a capacitance measurement circuit and a digital communication interface mimicking a tactile receptor of a human. We successfully integrated the force sensor and the ASIC into a 2.5×2.5×0.3 mm die and confirmed autonomously transmitted packets which contain digital sensing data with the linear force sensitivity of 57,640 Hz/N and 10 mN of data fluctuation. A small stray capacitance of 1.33 pF is achieved by use of 10 μm thick BCB isolation layer and this minimum package structure.

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“…In order to detect 3-axis force, we have used a new CMOS substrate with four channels of differential capacitive sensing circuits. Also, we have improved the sensor structure from the previous study to enhance sensitivity to not only normal force but also shear force [ 16 ]. This paper is organized as follows.…”

Section: Introductionmentioning

confidence: 99%

3-Axis Fully-Integrated Capacitive Tactile Sensor with Flip-Bonded CMOS on LTCC Interposer

Asano

Muroyama

Nakayama

et al. 2017

Sensors

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This paper reports a 3-axis fully integrated differential capacitive tactile sensor surface-mountable on a bus line. The sensor integrates a flip-bonded complementary metal-oxide semiconductor (CMOS) with capacitive sensing circuits on a low temperature cofired ceramic (LTCC) interposer with Au through vias by Au-Au thermo-compression bonding. The CMOS circuit and bonding pads on the sensor backside were electrically connected through Au bumps and the LTCC interposer, and the differential capacitive gap was formed by an Au sealing frame. A diaphragm for sensing 3-axis force was formed in the CMOS substrate. The dimensions of the completed sensor are 2.5 mm in width, 2.5 mm in length, and 0.66 mm in thickness. The fabricated sensor output coded 3-axis capacitive sensing data according to applied 3-axis force by three-dimensional (3D)-printed pins. The measured sensitivity was as high as over 34 Count/mN for normal force and 14 to 15 Count/mN for shear force with small noise, which corresponds to less than 1 mN. The hysteresis and the average cross-sensitivity were also found to be less than 2% full scale and 11%, respectively.

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3-Axis fully-integrated surface-mountable differential capacitive tactile sensor by CMOS flip-bonding

Cited by 13 publications

References 7 publications

Sensor Technologies for Automobiles and Robots

Sensor Technologies for Automobiles and Robots

Design and Fabrication Technology of Low Profile Tactile Sensor with Digital Interface for Whole Body Robot Skin

3-Axis Fully-Integrated Capacitive Tactile Sensor with Flip-Bonded CMOS on LTCC Interposer

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