3-D Antenna-in-Package Design with Metallic Coating Technique

Hsu, Chih-Chun; Lin, Sheng-Mou; Chen, Ying-Chih; Wu, W.; Chou, Che-Ya; Chen, Charles Nan-Cheng; Gao, Gavin; Wang, Chen-Chao

doi:10.1109/ectc.2018.00224

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) 2018

DOI: 10.1109/ectc.2018.00224

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3-D Antenna-in-Package Design with Metallic Coating Technique

Chih-Chun Hsu¹,

Sheng-Mou Lin²,

Ying-Chih Chen³

et al.

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Cited by 6 publications

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Heterogeneous Substrate and its Characterization for 5G mmWave Antenna in Package

Chang

Hsu

Kao

et al. 2021

2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

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3-D Antenna-in-Package Design with Metallic Coating Technique

Cited by 6 publications

References 5 publications

Heterogeneous Substrate and its Characterization for 5G mmWave Antenna in Package

Heterogeneous Substrate and its Characterization for 5G mmWave Antenna in Package

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