2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) 2018
DOI: 10.1109/eptc.2018.8654330
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Innovative Packaging Solutions of 3D System in Package with Antenna Integration for IoT and 5G Application

Mike Tsai
1
,
Ryan Chiu
2
,
Eric He
3
et al.
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Cited by 10 publications
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References 9 publications
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Innovative Packaging Solutions of 3D Double Side Molding with System in Package for IoT and 5G Application

Tsai
1
,
Chiu
2
,
Huang
3
et al. 2019
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
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Innovative Packaging Solutions of 3D Double Side Molding with System in Package for IoT and 5G Application

Tsai
1
,
Chiu
2
,
Huang
3
et al. 2019
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
18
0
3
0
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Heterogeneous Substrate and its Characterization for 5G mmWave Antenna in Package

Chang
1
,
Hsu
2
,
Kao
3
et al. 2021
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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EMI Shielding Technology in 5G RF System in Package Module

Li
1
,
Chiu
2
,
He
3
et al. 2020
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
23
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