Innovative Packaging Solutions of 3D Double Side Molding with System in Package for IoT and 5G Application

Tsai, Mike; Chiu, Ryan; Huang, Dick; Kao, Feng; He, Eric; Chen, J. Y.; Chen, Simon; Tsai, Jensen; Wang, Yu-Po

doi:10.1109/ectc.2019.00111

Cited by 18 publications

(3 citation statements)

References 10 publications

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“…For 5G systems point of view, the system-integration platforms (SiPs) including materials and interconnects are being used for the passive component purposes such as antenna arrays, passive structure components and feeding networks described in [1][2][3][4][5]. SiP packages used in 5G systems typically require or provide several particular technology properties: the integration of passive components with high quality factor, the integration of high gain antenna arrays, electromagnetic compatibility within high density circuits, wideband interconnections and power integrity, heterogeneous integration of several technologies, and finally high yield in fabrication and sufficient repairability.…”

Section: Introductionmentioning

confidence: 99%

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Thermoplastic Laminate and Cordierite/Indialite Glass-Ceramic Hybrid Package for 15-GHz Operated Antennas

Myllymäki

Sonkki

Kokkonen

et al. 2022

IEEE Trans. Compon., Packag. Manufact. Technol.

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This work describes novel antenna package a combination of a 4-element array and a lens antenna performing the gain of 13.5 dBi, the bandwidth of 1 GHz and the total efficiency of 72% at 15 GHz. The 2x2 elements array antenna was designed and fabricated using square patches with substrate through vias and a capacitive feeding on the novel dielectric substrate combination: thermoplastic laminate and cordierite/indialite glass-ceramic. The ceramic substrate was selected regarding its impressive dielectric properties a relative permittivity of 6.3 and a quality factor Qf 55,400 GHz. The array antenna performed with reflection coefficient -20dB over the bandwidth. The cascaded array with an extended hemispherical lens antenna enhanced the gain into the certain direction with narrow beamwidth properties. The packaged antenna is demonstrated for the 5G telecommunication systems especially where low losses, high temperature resistance and high temperature stability are required.

show abstract

Section: Introductionmentioning

confidence: 99%

“…Indialite/cordierite (Mg2Al4Si5O18) +10 wt.% is one of the solid-state synthetic silicates that have good dielectric properties, which has quality factor Qf = 55,400 GHz, relative permittivity of 6.3 and temperature coefficient of resonance frequency of (τf) of -21 ppm/℃, density of 2.6 g/cm 3 .…”

Section: Introductionmentioning

confidence: 99%

Thermoplastic Laminate and Cordierite/Indialite Glass-Ceramic Hybrid Package for 15-GHz Operated Antennas

Myllymäki

Sonkki

Kokkonen

et al. 2022

IEEE Trans. Compon., Packag. Manufact. Technol.

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show abstract

“…The SiP technology can miniaturize RF transceiver system and improve the performance and stability of the entire system. However, the increasing capacities and shrinking dimensions of SiP package will lead to a complex electromagnetic environment [1][2][3][4][5][6][7][8][9]. Hence, the EMI caused by the complex electromagnetic environment inside a SiP model has become a serious problem.…”

Section: Introductionmentioning

confidence: 99%

Improving Electromagnetic Compatibility Performance of Narrowband-Iot Sip Module

Sun¹,

Zhou²,

Huang³

et al. 2021

PIER M

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A package-board co-design method was applied for a Narrowband Internet of Things (NB-IoT) SiP module. The electromagnetic interference (EMI) generated by the module was studied by improving the transmission quality of radio frequency (RF) signal. The SiP models of the initial design and the optimized design were simulated separately to show that the optimized design significantly increased effective transmission power of the RF signal and suppressed near-field electromagnetic radiation intensity to a certain extent. In addition, the optimized design model was verified by measurement. The measured results show good agreement with the simulated ones and demonstrate that the package-board co-design method can improve the electromagnetic compatibility (EMC) of NB-IoT applications.

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System-in-Package (SiP)

Lau

2021

Semiconductor Advanced Packaging

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Innovative Packaging Solutions of 3D Double Side Molding with System in Package for IoT and 5G Application

Cited by 18 publications

References 10 publications

Thermoplastic Laminate and Cordierite/Indialite Glass-Ceramic Hybrid Package for 15-GHz Operated Antennas

Thermoplastic Laminate and Cordierite/Indialite Glass-Ceramic Hybrid Package for 15-GHz Operated Antennas

Improving Electromagnetic Compatibility Performance of Narrowband-Iot Sip Module

System-in-Package (SiP)

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