3-D Printed Microjet Impingement Cooling for Thermal Management of Ultrahigh-Power GaN Transistors

Zhang, G.; Pomeroy, James W.; Navarro, María Elena; Kuball, Martin; Ding, Yulong

doi:10.1109/tcpmt.2021.3072994

Cited by 13 publications

(2 citation statements)

References 30 publications

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“…Up to now, various effective liquid-cooled solutions have been developed, such as microchannel heat sinks [10,11], micro-heat pipes [12], microjet heat sinks [13,14], etc. Among them, the microchannel heat sink is the most prospective one due to the advantages of compact structure, light weight, high heat transfer surface area and easy integration with electronic devices.…”

Section: Introductionmentioning

confidence: 99%

Microscopic Exploration of Liquid-liquid Phase Separation Mechanism in LCST Solutions

Ding¹,

Feng²,

Yuan³

et al. 2022

ES Energy Environ.

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A partially miscible solution with a lower critical solution temperature (LCST) is a potential coolant for microchannel heat sinks to meet the multi-goals of high cooling performance, low-pressure drop and stable operation. However, it is a great challenge to fundamentally understand the liquid-liquid phase separation mechanism, and to harvest benefits from it for evaluating the cooling performance and regulating the flow pattern of the LCST solutions in microchannels. Here, we observed and explained the liquid-liquid phase separation behaviors of 2-Butoxyethanol/water solutions with various mass fractions (ωp) and heating rates, consisting of spinodal decomposition or nucleation, droplet growth (diffusion-driven), and droplet coalescence (convectiondriven, stage Ⅰ and stage Ⅱ). The results proved that the separated molecular cluster is covered with a layer of water molecules, causing the mass fraction of 2-Butoxyethanol in the separated liquid to be 65.4% instead of 100%. To keep a mist or droplet flow pattern in microchannels, some efforts must be made to reduce the droplet diameter and suppress the droplet coalescence in stage Ⅱ. Although the solutions with better cooling performance have been determined at ωp=27.4%~35%, future works should focus on whether the liquid-liquid phase separation ends at the droplet growth stage or coalescence stage.

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Section: Introductionmentioning

confidence: 99%

Microscopic Exploration of Liquid-liquid Phase Separation Mechanism in LCST Solutions

Ding¹,

Feng²,

Yuan³

et al. 2022

ES Energy Environ.

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show abstract

“…In [20], an extensive review of the different liquid cooling solutions is provided. Radio-frequency GaN transistors are directly cooled using the microjet impingement technique [21]. Moreover, the authors improved the GaN packaging using diamond, which further enhanced the heat dissipation.…”

Section: Introductionmentioning

confidence: 99%

Effect of the Heat Dissipation System on Hard-Switching GaN-Based Power Converters for Energy Conversion

et al. 2021

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The design of a cooling system is critical in power converters based on wide-bandgap (WBG) semiconductors. The use of gallium nitride enhancement-mode high-electron-mobility transistors (GaN e-HEMTs) is particularly challenging due to their small size and high power capability. In this paper, we model, study and compare the different heat dissipation systems proposed for high power density GaN-based power converters. Two dissipation systems are analysed in detail: bottom-side dissipation using thermal vias and top-side dissipation using different thermal interface materials. The effectiveness of both dissipation techniques is analysed using MATLAB/Simulink and PLECS. Furthermore, the impact of the dissipation system on the parasitic elements of the converter is studied using advanced design systems (ADS). The experimental results of the GaN-based converters show the effectiveness of the analysed heat dissipation systems and how top-side cooled converters have the lowest parasitic inductance among the studied power converters.

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Microfluidic cooling for GaN electronic devices

Erp¹,

Matioli²

2022

Thermal Management of Gallium Nitride Electronics

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3-D Printed Microjet Impingement Cooling for Thermal Management of Ultrahigh-Power GaN Transistors

Cited by 13 publications

References 30 publications

Microscopic Exploration of Liquid-liquid Phase Separation Mechanism in LCST Solutions

Microscopic Exploration of Liquid-liquid Phase Separation Mechanism in LCST Solutions

Effect of the Heat Dissipation System on Hard-Switching GaN-Based Power Converters for Energy Conversion

Microfluidic cooling for GaN electronic devices

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