2014 IEEE 64th Electronic Components and Technology Conference (ECTC) 2014
DOI: 10.1109/ectc.2014.6897413
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336-Channel electro-optical interconnect: Underfill process improvement, fiber bundle and reliability results

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Cited by 8 publications
(2 citation statements)
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“…The optoelectronics were assembled on the active CMOS chip, which inevitably consumes valuable silicon area and increases the associated costs. A special optical fiber-bundle assembly was also needed for the full package demonstration [7]. A back-end-of-line processed silicon interposer-based transceiver was also demonstrated [8]; however, the process included numerous electrical through silicon vias (TSVs) and optical holes, delaying its introduction into high volume manufacturing.…”
Section: Introductionmentioning
confidence: 99%
“…The optoelectronics were assembled on the active CMOS chip, which inevitably consumes valuable silicon area and increases the associated costs. A special optical fiber-bundle assembly was also needed for the full package demonstration [7]. A back-end-of-line processed silicon interposer-based transceiver was also demonstrated [8]; however, the process included numerous electrical through silicon vias (TSVs) and optical holes, delaying its introduction into high volume manufacturing.…”
Section: Introductionmentioning
confidence: 99%
“…However, in both scenarios, the number of channels is approaching their limits. The fiber connector of parallel optics becomes bulky and needs to be carefully designed [3]. In the WDM system, the usable wavelength channels, ranging from 1300 nm to 1700 nm, are limited by the amplification technologies [4].…”
mentioning
confidence: 99%