Co-Packaged Optics With Multimode Fiber Interface Employing 2-D VCSEL Matrix

Abstract

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Co-packaged optics: optical infrastructure from the faceplate to the PIC

“…While the current focus of CPO development generally assumes an external laser source, note that there is interest in enabling use of on-chip sources [4,5].…”

“…In this paper we discuss the impact of this transition on the optics between the PIC and the faceplate connectors and the new design considerations that arise with the CPO paradigm shift. In the following we consider CPO and pluggable architectures that have optical links operating in the O-band over single-mode fiber, but we note in passing that some solutions under study use multimode fiber [3,4,5].…”