3D FEM for Sintering of Solar Cell with Boron Back Surface Field Based on Solidwork Simulation

Thermal deformation analysis of tabbed solar cells using solder alloy and conductive film

“…The results indicate that the residual stress is mainly concentrated at the junction between the soldering track and the two edges of the cell. The increasing residual stress may cause damage to the wafer region near the electrode (13)(14)(15)(16) . Therefore, the interconnection at lower temperature is needed to reduce the thermal stress due to soldering.…”