Thermal deformation analysis of tabbed solar cells using solder alloy and conductive film

Hasan, Md. Kamrul; Sasaki, Katsuhiko

doi:10.1007/s12206-016-0617-4

Cited by 7 publications

(2 citation statements)

References 19 publications

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“…The cracks are considered to appear in the vicinity of the solder and Ag interface along the grain boundary of the solder. 24) It is suggested that cracking of solder interconnections under thermomechanical loadings is enhanced by the recrystallization because the network of newly formed grain boundaries extending through the interconnections provides favorable paths for cracks to propagate intergranularly. 25) Failure modes are dependent on the localized microstructural changes in the strain concentration regions of the interconnections and the crack paths follow the networks of grain boundaries produced by recrystallization.…”

Section: Thermal Cycling (Tc) Testmentioning

confidence: 99%

“…Also, stress from residual stress, 27) caused by CTE mismatch associated with creep strain, 28,29) resulted in initial cracks along the grain boundary of the solder. 24) Figure 9 shows EDX results at each cycle. Ni or Sn counts peaks appeared in the Ag layer because the Ag layers have defects after the Ag paste was sintered with Si, and Ni or Sn particles remained in the defects of the Ag layer during the polishing process.…”

Section: Thermal Cycling (Tc) Testmentioning

confidence: 99%

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Improvement in the reliability of crystalline silicon solar cell interconnection by using Nickel Micro-Plating Bonding (NMPB) technology

Morisako

et al. 2022

Jpn. J. Appl. Phys.

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It is popular to research promoting the light conversion efficiency of crystalline silicon solar cell photovoltaic (PV) modules. However, excellent light conversion efficiency does not mean it could maintain initial performance after long-term running. Long-term reliability of interconnection to assemble crystalline silicon solar cells in PV modules is critical to ensure that the device performs continually for up to 20 years. It is reported that most crystalline PV modules fail from corrosion and breakage of the interconnector with the solder joint. As a result, improvement of interconnection technology is highly necessary. Nickel (Ni) Micro-Plating Bonding (NMPB) is an innovative interconnection technology for crystalline silicon solar cells: copper ribbons bonded with lead or lead-free solder are replaced by copper wires bonded with Ni electroplating film. The NMPB interconnection provides key advantages: low temperature (55 °C) process, enhancement of reliability from strain and stress caused by high temperature, and coefficient of thermal expansion (CTE) mismatch between metal and silicon. Furthermore, the material of NMPB, Ni, possesses excellent corrosion resistance. High reliability was confirmed with about 1.9% degradation of output power for up to 1000 thermal cycling tests and 3.8% for 1000 h of damp heat tests in bare NMPB solar cells, while 64.7% degradation in thermal cycling tests and 23.0% in damp heat tests were confirmed in solder bonding solder cells.

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Section: Thermal Cycling (Tc) Testmentioning

confidence: 99%