2015 IEEE 65th Electronic Components and Technology Conference (ECTC) 2015
DOI: 10.1109/ectc.2015.7159817
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3D heterogeneous integration structure based on 40 nm- and 0.18 µm-technology nodes

Yuping Hu
1
,
Cheng Feng Lin
2
,
Y. F. Hsieh
3
et al.
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