3D Integration Based upon Dielectric Adhesive Bonding

Nanosystems Utilizing Three-Dimensional Integration and Gas Dielectrics for Enhanced System Performance

“…1j), patible 3D integration using adhesive and metal/ad-• bonding of damascene-patterned metal/adhesive hesive as the bonding interfaces (11,12,14). This redistribution layer (Fig.…”

“…This further requires 1) atomic flat bondthors (R.J.G.) leadership from 2000 through 2005 ing surfaces (e.g., for oxide bonding) and/or 2) dif- (11,12,14). They are based on a classic blanket fusion of atoms across the bonding interface during polymer adhesive bonding with a via-last process bonding or postbond anneal.…”

“…integration processing steps using BCB in adhesive Using Figure 2A as an example (11), two prowafer bonding is summarized in Table 1. Three key cessed wafers with active device layers and multiadvantages of this approach compared to other level on-chip interconnects are aligned to tolerbonded wafer techniques are: 1) the ability of the ances within ϳ1 µm and bonded using adhesive.…”

“…Schematic cross section of three-stratum stack of 3D platforms, showing two bonding interfaces and through-strata-vias (TSVs)(11).…”