3D integration technologies for emerging microsystems

Abstract

The next generation of small form factor (SFF) microsystem technologies can only keep up with increased functionality and performance demands by using the third dimension. 3D integration technologies can be grouped into following distinct technology approaches: (i) 3D-monolithic IC integration, (ii) 3D stacking of IC-dies, wafers and packages, and (iii) 3D integrated packaging. This paper provides an overview on the various 3D integration and enabling technologies as well as the associated challenges that exist for SFF wireless system implementation with optimum cost and performance.

Piezoresistive silicon nanowire resonators as embedded building blocks in thick SOI

“…The present study addresses the integration of Si NW resonators with higher-order structures in modern electronic devices [17,36]. Implementation of in situ actuation and readout in electromechanical resonators can also enable the incorporation of large resonator arrays in very-large scale integration (VLSI) [9,11].…”

Doğu Akdeniz’de Denizaltı Telgraf Bağlantıları: Yunanistan’ın Uluslararası Şebekeye Dahil Edilmesi

“…Ancak ilk olması hasebiyle önem atfettiğimiz bu girişim, şüphesiz ki uluslararası telgraf haberleşmesi alanında stratejik konumunun önemini idrak etmesi ve bu çerçevede temkinli politikalar izlemesi bakımında da Bâb-ı Âli için öğretici bir girişim olmuştur. Ayrıca, tesis edilmeye başlanan iyi ilişkiler ilerleyen yıllarda gerçekleştirilecek İngiliz-Osmanlı işbirliklerine de zemin hazırlamıştır 7 .…”

Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding

“…Recently, electronic devices have been used in microelectronic package technologies [ 1 , 2 , 3 ] with advanced capabilities, such as multi-functions, high densities of input/output, and high capacities. To achieve high performance and miniaturization, various packages are mounted on an electronic substrate.…”

“…Prior to the 2000s, Sn–Pb solder alloys were the most commonly used joint materials because of their excellent properties, such as wettability, low melting temperature, and cost competitiveness. However, the use of Pb was banned by the Restriction of Hazardous Substances Directive and Waste Electrical and Electronic Equipment because of its toxicity to humans and the environment [ 1 , 2 , 3 , 4 , 5 ]. Therefore, various kinds of Pb-free Sn-based solder families, such as Sn–Ag, Sn–Cu, Sn–Zn, Sn–Bi, and Sn–In, have been developed to replace the Sn–Pb solder [ 6 , 7 , 8 ].…”