“…The etched Cu foam was dried at 100 C in vacuum for 24 h, and a heat treatment was carried out at 500 o C under H 2 atmosphere during 5 h for a reduction of copper oxide to metallic copper in the etched Cu foam. After that, for a SnO 2 coating process, the solgel method based on our reports for the fabrication of SnO 2 -coated Cu foam was applied also in this study [10,11]. The commercially available Cu foam, the Cu foam after etching by the electroless plating, the Cu foam after the H 2 heat-treatment, and the Cu foam after the SnO 2 coating were referred to as Pristine Cu foam, Etched Cu foam, Etched Cu foam after H 2 , and SnO 2 /Etched Cu foam, respectively.…”