3D mask modules using two-photon direct laser writingtechnology for continuous lithography process on fibers

Hayashi, Masahiro; Zhang, Yi; Hayase, Masanori; Itoh, Toshihiro; Maeda, Ryutaro

doi:10.1109/memsys.2014.6765573

Cited by 2 publications

(2 citation statements)

References 8 publications

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“…The SLA process takes into account all the sub-processes such as exposure, photoinitiation, photopolymerization, mass and heat transfer (Hayashi et al , 2014). The SLA possesses good accuracy and applies for varied application areas (Castro e Costa et al , 2017; Gao et al , 2015).…”

Section: Introductionmentioning

confidence: 99%

Classification of challenges in 3D printing for combined electrochemical and microfluidic applications: a review

Arivarasi

Kumar²

2019

RPJ

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Purpose The purpose of this paper is to describe, review, classify and analyze the current challenges in three-dimensional printing processes for combined electrochemical and microfluidic fabrication areas, which include printing devices and sensors in specified areas. Design/methodology/approach A systematic review of the literature focusing on existing challenges is carried out. Focused toward sensors and devices in electrochemical and microfluidic areas, the challenges are oriented for a discussion exploring the suitability of printing varied geometries in an accurate manner. Classifications on challenges are based on four key categories such as process, material, size and application as the printer designs are mostly based on these parameters. Findings A key three-dimensional printing process methodologies have their unique advantages compared to conventional printing methods, still having the challenges to be addressed, in terms of parameters such as cost, performance, speed, quality, accuracy and resolution. Three-dimensional printing is yet to be applied for consumer usable products, which will boost the manufacturing sector. To be specific, the resolution of printing in desktop printers needs improvement. Printing scientific products are halted with prototyping stages. Challenges in three-dimensional printing sensors and devices have to be addressed by forming integrated processes. Research limitations/implications The research is underway to define an integrated process-based on three-dimensional Printing. The detailed technical details are not shared for scientific output. The literature is focused to define the challenges. Practical implications The research can provide ideas to business on innovative designs. Research studies have scope for improvement ideas. Social implications Review is focused on to have an integrated three-dimensional printer combining processes. This is a cost-oriented approach saving much of space reducing complexity. Originality/value To date, no other publication reviews the varied three-dimensional printing challenges by classifying according to process, material, size and application aspects. Study on resolution based data is performed and analyzed for improvements. Addressing the challenges will be the solution to identify an integrated process methodology with a cost-effective approach for printing macro/micro/nano objects and devices.

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Section: Introductionmentioning

confidence: 99%

Classification of challenges in 3D printing for combined electrochemical and microfluidic applications: a review

Arivarasi

Kumar²

2019

RPJ

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“…The 3D cylindrical projection photolithography technology has been introduced in detail in our previous works. [15][16][17][18] Using the new technology, various microsensors including temperature sensors, 15) electrochemical electrodes 17,18) and other functional micro structures 16) have been successfully fabricated onto fiber substrates with the outer diameter of 300 µm. In particular, the temperature microsensor is very interesting for us because it is one of the most important and basic tools for precisely monitoring the health status of living tissues and much effort has been made.…”

Section: Introductionmentioning

confidence: 99%

Fiber-based temperature microsensor by using three-dimensional photomask

Kim

Zhang

Hayase

2017

Jpn. J. Appl. Phys.

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In this paper we present a new three-dimensional (3D) photomask technology for the direct fabrication of temperature microsensors on tiny fiber substrates. The 3D photomask consists of an exposure module having two half-pipe substrates with the outer and inner diameters of 1.8 and 0.32 mm, respectively, which have fine patterns of thin Cr metal film. Using the 3D photomask, two resistive temperature microsensors of thin Pt metal film including wiring pads are successfully and directly fabricated on different sides of the same quartz capillary with the outer and inner diameters of 300 and 180 µm, respectively. The minimum pattern width of the temperature microsensors is about 10 µm. The as-prepared temperature microsensors have shown excellent linear response to the variations in of temperature from 25 to 80 °C. It indicates that the fiber based temperature microsensor could be expected in many applications in biomedical devices.

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3D mask modules using two-photon direct laser writingtechnology for continuous lithography process on fibers

Cited by 2 publications

References 8 publications

Classification of challenges in 3D printing for combined electrochemical and microfluidic applications: a review

Classification of challenges in 3D printing for combined electrochemical and microfluidic applications: a review

Fiber-based temperature microsensor by using three-dimensional photomask

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