2014
DOI: 10.1117/12.2052482
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3D optimization of a polymer MOEMS for active focusing of VCSEL beam

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Cited by 4 publications
(4 citation statements)
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“…As seen in figure 10(b), a maximal vertical displacement of ~8 µm was obtained for an actuation power of only 12 mW in both cases. These performances are in good agreement with the theoretical behaviour expected for this optimized design [27]. Moreover, the standard deviation of the measured displacement to its average value was equal or less than 0.5 µm, demonstrating the good reproducibility achievable using dry resist films for MOEMS fabrication process.…”
Section: Moems Characterizationsupporting
confidence: 86%
See 1 more Smart Citation
“…As seen in figure 10(b), a maximal vertical displacement of ~8 µm was obtained for an actuation power of only 12 mW in both cases. These performances are in good agreement with the theoretical behaviour expected for this optimized design [27]. Moreover, the standard deviation of the measured displacement to its average value was equal or less than 0.5 µm, demonstrating the good reproducibility achievable using dry resist films for MOEMS fabrication process.…”
Section: Moems Characterizationsupporting
confidence: 86%
“…First, a titanium layer was deposited to serve as an actuation electrode material (50 nm). Second, a thicker gold layer (300 nm) was deposited to localize the power dissipation within the suspended areas [27]. These two metallization steps were achieved before DF-1050 development.…”
Section: Development Of a New Moems Fabrication Processmentioning
confidence: 99%
“…11 to illustrate the good agreement with the experimental data for both cases. Further details on this study can be found elsewhere [54]. Additional studies on MEMS cycling and reliability are now underway to estimate thermal actuation hysteresis observed for effective power greater than 30 mW corresponding to an actuation temperature of 150°C.…”
Section: A Moems Mechanical Behaviormentioning
confidence: 97%
“…6) However, the thickness homogeneity is still an issue to be solved. [7][8][9] Furthermore, coating μm thick SU-8 on a flexible film is difficult with the conventional techniques by utilizing the liquid resist. 10) To address this problem, a dry film resist (DFR), commonly utilized in printed circuit boards (PCBs), has been proposed to substitute the SU-8 liquid resist.…”
Section: Introductionmentioning
confidence: 99%