3D packaging solutions for a silicon micropump

Kelly, G.; Alderman, J.; Lyden, C.; Barrett, J.; Morrissey, B.A.; Val, A.; Sbiaa, Zouhair; Camon, Henri

doi:10.1109/ectc.1997.606332

Cited by 2 publications

(1 citation statement)

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“…Developed primarily for military and space applications by companies such as Irvine Sensors Corporation, USA and 3D Plus, France, these super stacks are now found in micrccameras for satellites[l7, 18,19]. NMRC's experience in 3D packaging stems from involvement in the EU funded TRIMOD and BARMINT projects [20,21,22].…”

Section: -D Packagingmentioning

confidence: 98%

Development of distributed sensing systems of autonomous micro-modules

Barton¹,

Delaney²,

Bellis³

et al.

53rd Electronic Components and Technology Conference, 2003. Proceedings.

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This paper focuses on the development of miniaturised modular wireless sensor networks that can be used to realise distributed autnnomous sensors for future ad-hoc networks. Such modular, mobile networks are key enablig technologies in the field of ubiquitous computing and wearable electronics.The Ambient Systems team in the NMRC has adopted a phased approach to developing ultra-miniature sensor nodes with a goal of implementation of a 1mm3 (or less) autonomous sensor module. This paper will detail the progress through phases 1 and 2. The phase 1 modules are 25mm cubes, fabricated as a 3-D stackable modular PCB, which can he mounted on mobile devices or wom on the body; they can measure acceleration, rotation, shock. elevation etc. and have an ultra low-power RF channel-shared link to a base station. There are numerous possible applications in the fields of sports, exercise, entertainment and health. Extra panels, including sensory, memory or computation can be designed and added as needed. This make the phase 1 module a powerful test platform for developing future automous sensor systems.The phase 2 modules have a much reduced form factor, approximately a lcm cube; as well as the modularity developed in phase 1, the phase 2 form contains actuators and a PLD platform. lntrnductinnMajor research efforts are currently targeting the "disappearance" of the computer into the fabric of our environment. In the future, the spaces we live in will be populated by many thousands of objects (often described as "artefacts") with the ability to sense and actuate in their environment, to perform localised computation, and to communicate, even collaborate with each other. Artefacts are playing a large role in research towards intelligent systems and ubiquitous computing [l]. There are two prime drivers: the smaller these objects are the more effective they will be in providing opportunities for integrating the physical and digital worlds, and the greater the number of objects within these systems/networks the more valuable the networks are (Metcalfe's Law). The main properties required to maximise the capabilities of such networks are that it should have high granularity (i.e. high resolution), reconfigurability modularisation and mobility.The system level implementation will be realised through concurrent hardware and software co-design and engineering; innovation in software should be matched by invention in hardware. It is notable in this regard that many issues are comparably

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Section: -D Packagingmentioning

confidence: 98%