3D Printing multifunctionality: structures with electronics

Espalin, David; Muse, Dan; MacDonald, Eric; Wicker, Ryan B.

doi:10.1007/s00170-014-5717-7

Cited by 530 publications

(286 citation statements)

References 31 publications

Supporting

Mentioning

276

Contrasting

Unclassified

Order By: Relevance

“…Interconnect parasitic losses can quickly add up to degrade the overall system performance. Therefore, it is critical to have near-bulk metal conductivity, while maintaining reliable conductivity over temperature and environmental excursions [13,93,103,104]. While there are many different techniques that have been investigated for interconnects in DW processes, the current best performers are AJP and wire mesh embedding.…”

Section: Printed Transmission Lines and Interconnectsmentioning

confidence: 99%

Printable Materials for the Realization of High Performance RF Components: Challenges and Opportunities

Rosker

Sandhu

Hester

et al. 2018

International Journal of Antennas and Propagation

View full text Add to dashboard Cite

Printing methods such as additive manufacturing (AM) and direct writing (DW) for radio frequency (RF) components including antennas, filters, transmission lines, and interconnects have recently garnered much attention due to the ease of use, efficiency, and low-cost benefits of the AM/DW tools readily available. The quality and performance of these printed components often do not align with their simulated counterparts due to losses associated with the base materials, surface roughness, and print resolution. These drawbacks preclude the community from realizing printed low loss RF components comparable to those fabricated with traditional subtractive manufacturing techniques. This review discusses the challenges facing low loss RF components, which has mostly been material limited by the robustness of the metal and the availability of AM-compatible dielectrics. We summarize the effective printing methods, review ink formulation, and the postprint processing steps necessary for targeted RF properties. We then detail the structure-property relationships critical to obtaining enhanced conductivities necessary for printed RF passive components. Finally, we give examples of demonstrations for various types of printed RF components and provide an outlook on future areas of research that will require multidisciplinary teams from chemists to RF system designers to fully realize the potential for printed RF components.

show abstract

Section: Printed Transmission Lines and Interconnectsmentioning

confidence: 99%

Printable Materials for the Realization of High Performance RF Components: Challenges and Opportunities

Rosker

Sandhu

Hester

et al. 2018

International Journal of Antennas and Propagation

View full text Add to dashboard Cite

show abstract

“…The relevance of the study is in demonstrating the benefits of utilizing these three growing trends [24,29,30,32,34,35], when adopted in concert, in terms of improved sustainability and start-up opportunities. Empirical testing of this integrated approach was conducted in the mobile forensics sector.…”

Section: Discussionmentioning

confidence: 99%

How to Deliver Open Sustainable Innovation: An Integrated Approach for a Sustainable Marketable Product

et al. 2016

View full text Add to dashboard Cite

Abstract:The adoption of open innovation and peer production, powered by 3D printing technology, is transforming traditional manufacturing methods towards a "third industrial revolution". The purpose of this research is to provide empirical evidence for an integrated approach, based on collaborative product development and peer production, combined with 3D printing, to deliver more sustainable, yet competitive, marketable products. In particular, this experimental study is conducted in the context of mobile forensics, an emerging market where limited expensive products exist and alternative solutions are needed. The technical viability and economic feasibility of the prototype developed in this research validate the proposed integrated approach, which could be a game-changer in the field of mobile forensics, as well as in other sectors. The sustainability improvements with this approach are a reduction of the total cost, thereby making it affordable for lower income users, and a decrease in energy consumption and pollutant emissions. The validated integrated approach offers start-up opportunities to develop and deliver more sustainable, marketable products, towards the paradigm of Open Sustainable Innovation. While the device developed and tested in this research has similar features to existing products, the methodology, implementation, and motivation are original.

show abstract

“…It has the potential to unlock various application domains where conventional manufacturing techniques are not cost-effective. Potential applications include (but are not limited to) customised lighting [3], antenna structures [4] and wearable electronic devices [5]. There are a number of challenges in terms of materials, tools and processes that need to be overcome to achieve this high integration potential.…”

Section: Introductionmentioning

confidence: 99%

3D Printed structural electronics: embedding and connecting electronic components into freeform electronic devices

Maalderink

Bruning

Schipper

et al. 2017

Plastics, Rubber and Composites

View full text Add to dashboard Cite

The need for personalised and smart products drives the development of structural electronics with mass-customisation capability. A number of challenges need to be overcome in order to address the potential of complete free form manufacturing of electronic devices. One key challenge is the integration of conductive structures and components into 3D printed devices by combining different materials and printing techniques that have nearly incompatible printing conditions. In this paper, several methods to integrate electronic circuits and components into a 3D printed structure are discussed. The functional performance of the resulting structures is described. Structural parts were manufactured with a stereolithography-based 3D printing technique, which was interrupted to pick and place electronic components, followed by either direct writing or squeegee filling of conductive material. A thermal curing step was applied to enhance the bonding and improve the electrical performance. Optical micrography, 4-point resistance measurement and crosssectional analysis were performed to evaluate functionality. ARTICLE HISTORY

show abstract

3D Printing multifunctionality: structures with electronics

Cited by 530 publications

References 31 publications

Printable Materials for the Realization of High Performance RF Components: Challenges and Opportunities

Printable Materials for the Realization of High Performance RF Components: Challenges and Opportunities

How to Deliver Open Sustainable Innovation: An Integrated Approach for a Sustainable Marketable Product

3D Printed structural electronics: embedding and connecting electronic components into freeform electronic devices

Contact Info

Product

Resources

About