No abstract

In new product development, time to market (TTM) is critical for the success and profitability of next generation products. When these products include sophisticated electronics encased in 3D packaging with complex geometries and intricate detail, TTM can be compromised-resulting in lost opportunity. The use of advanced 3D printing technology enhanced with component placement and electrical interconnect deposition can provide electronic prototypes that now can be rapidly fabricated in comparable time frames as traditional 2D bread-boarded prototypes; however, these 3D prototypes include the advantage of being embedded within more appropriate shapes in order to authentically prototype products earlier in the development cycle. The fabrication freedom offered by 3D printing techniques, such as stereolithography and fused deposition modeling have recently been explored in the context of 3D electronics integrationreferred to as 3D structural electronics or 3D printed electronics. Enhanced 3D printing may eventually be employed to manufacture end-use parts and thus offer unit-level customization with local manufacturing; however, until the materials and dimensional accuracies improve (an eventuality), 3D printing technologies can be employed to reduce development times by providing advanced geometrically appropriate electronic prototypes. This paper describes the development process used to design a novelty six-sided gaming die. The die includes a microprocessor and accelerometer, which together detect motion and upon halting, identify the top surface through gravity and illuminate light-emitting diodes for a striking effect. By applying 3D printing of structural electronics to expedite prototyping, the development cycle was reduced from weeks to hours.INDEX TERMS 3D printed electronics, additive manufacturing, direct-print, electronic gaming die, hybrid manufacturing, rapid prototyping, structural electronics, three-dimensional electronics.

No abstract

No abstract

Fabricating entire systems with both electrical and mechanical content through on-demand 3D printing is the future for high value manufacturing. In this new paradigm, conformal and complex shapes with a diversity of materials in spatial gradients can be built layer-by-layer using hybrid Additive Manufacturing (AM). A design can be conceived in Computer Aided Design (CAD) and printed on-demand. This new integrated approach enables the fabrication of sophisticated electronics in mechanical structures by avoiding the restrictions of traditional fabrication techniques, which result in stiff, two dimensional printed circuit boards (PCB) fabricated using many disparate and wasteful processes. The integration of Additive Manufacturing (AM) combined with Direct Print (DP) micro-dispensing and robotic pick-and-place for component placement can 1) provide the capability to print-on-demand fabrication, 2) enable the use of micron-resolution cavities for press fitting electronic components and 3) integrate conductive traces for electrical interconnect between components. The fabrication freedom introduced by AM techniques such as stereolithography (SL), ultrasonic consolidation (UC), and fused deposition modeling (FDM) have only recently been explored in the context of electronics integration and 3D packaging. This paper describes a process that provides a novel approach for the fabrication of stiff conformal structures with integrated electronics and describes a prototype demonstration: a volumetrically-efficient sensor and microcontroller subsystem scheduled to launch in a CubeSat designed with the CubeFlow methodology.