3D technology applications market trends &amp;amp; key challenges

Pizzagalli, Amandine; Buisson, Thibault; Beica, Rozalia

doi:10.1109/asmc.2014.6846981

Cited by 13 publications

(3 citation statements)

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“…Compared with off-chip signalling 3D packaging, 3D ICs interact through on-chip signalling [ 28,29 ]. In 3D ICs, the most significant elements of the enabling technology for handling and double-sided processing of extremely thin chips are the temporary bonding and debonding processes at lower temperature and higher throughput [ 30 ]. A well-known bonding method that has become noteworthy in the production process for 3D ICs stacking minimization is thermal compression bonding, whereby two metals are ideally bonded together by heating and compression [ 31,32 ].…”

Section: Three-dimensional Integrated Circuits: the Technologymentioning

confidence: 99%

Intermetallic compounds in 3D integrated circuits technology: a brief review

Annuar

Mahmoodian

Hamdi

et al. 2017

Science and Technology of Advanced Materials

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The high performance and downsizing technology of three-dimensional integrated circuits (3D-ICs) for mobile consumer electronic products have gained much attention in the microelectronics industry. This has been driven by the utilization of chip stacking by through-Si-via and solder microbumps. Pb-free solder microbumps are intended to replace conventional Pb-containing solder joints due to the rising awareness of environmental preservation. The use of low-volume solder microbumps has led to crucial constraints that cause several reliability issues, including excessive intermetallic compounds (IMCs) formation and solder microbump embrittlement due to IMCs growth. This article reviews technologies related to 3D-ICs, IMCs formation mechanisms and reliability issues concerning IMCs with Pb-free solder microbumps. Finally, future outlook on the potential growth of research in this area is discussed.

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Section: Three-dimensional Integrated Circuits: the Technologymentioning

confidence: 99%

Intermetallic compounds in 3D integrated circuits technology: a brief review

Annuar

Mahmoodian

Hamdi

et al. 2017

Science and Technology of Advanced Materials

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“…New needs and directions in microelectronics and ultrafast electronics Angelo Rivetti vias, TSV). Many technical challenges still need to be addressed before the 3D approach can be systematically used in high volume industrial production [20], but 3D integration is likely to be one of the tools that will allow the continuation of Moore law beyond what it possible with planar 2D scaling.…”

Section: Pos(ifd2015)036mentioning

confidence: 99%

New needs and directions in microelectronics and ultrafast electronics

Rivetti¹

2017

Proceedings of INFN Workshop on Future Detectors — PoS(IFD2015)

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“…Packages have been getting smaller but carrying an increased number of signals (Saha, 2013;Battestini et al, 2007). With this trend and various challenges, the new materials and technologies that complement the strengths and weaknesses of existing products is being actively studied (Pizzagalli et al, 2014;Zhang et al, 2019;Bolanos, 2005). Leadframe packages, the mainstream of semiconductor package products, has superb thermal characteristics, simple process and high reliability characteristics, but has a limitation in signal integration because of its single layer configuration.…”

Section: Introductionmentioning

confidence: 99%

The advanced leadless leadframe package and its characteristics

Kim¹,

Jeon²,

Gijeong³

et al. 2023

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Purpose The purpose of this study is to offer the advanced leadless leadframe package which achieve small form factor and high thermal and electrical performance, according to the continuous market requirement. Because of demand and trends, new package structures that can accommodate many pins (I/Os) while maintaining the excellent thermal and electrical properties of the leadframe package was studied. Different from conventional leadframe and laminate packages, it must have the large-exposed pad for thermal dissipation and design flexibility to deploy signal, ground and power selectively. Design/methodology/approach In this study, the routable molded leadframe (rtMLF®) package applying the pre-resin MLF substrate was introduced. The structural advantages, in terms of design flexibility, were checked by adopting the specific electrical feature. Also, the excellence of thermal and electrical performance was confirmed by simulation. The sample was manufactured, and its package robustness was validated by reliability test. Findings rtMLF package that enables one layer substrate but routable pattern on top layer differently from existing leadframe package was developed and studied if it overcome the limitations of leadframe and laminate products. Asymmetric land layout was designed and special features to keep electrical interference was applied to prove design flexibility. The thermal and electrical simulation has been executed to check the advantages. And key differentiations were identified. Finally, actual sample was manufactured, and structural robustness was validated by package level and board level reliability. Originality/value The differentiation of new semiconductor package was introduced and its excellence was verified by electrical and thermal simulation as well as reliability test. It is expected to be adopted for alternative solutions not covered by the existing products.

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3D technology applications market trends & key challenges

Cited by 13 publications

References 0 publications

Intermetallic compounds in 3D integrated circuits technology: a brief review

Intermetallic compounds in 3D integrated circuits technology: a brief review

New needs and directions in microelectronics and ultrafast electronics

The advanced leadless leadframe package and its characteristics

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