4,6-Dimethyl-2-mercaptopyrimidine as a potential leveler for microvia filling with electroplating copper

Tang, Mingxing; Zhang, Shengtao; Qiang, Yujie; Chen, Shijin; Luo, Li; Gao, Jingqing; Feng, Li; Qin, Zhongjian

doi:10.1039/c7ra06857c

Cited by 38 publications

(15 citation statements)

References 70 publications

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“…According to previous research, high electron density regions (e. g., N=N of JGB) have strong coordination and adsorption capability to the copper surface. [13] This region could offer electrons to the lowenergy empty molecular orbitals of copper to form a coordinate/covalent bond, [15,52] which indicated that the carbonyl region of 1 e was the probable adsorption site for the adsorption of 1 e on the copper surface.…”

Section: Resultsmentioning

confidence: 99%

Fatty Acid Quaternary Ammonium Surfactants Based on Renewable Resources as a Leveler for Copper Electroplating

Zhao

et al. 2019

ChemElectroChem

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A series of fatty acid quaternary ammonium surfactants (FAQAS 1 a–1 f) derived from renewable resource of fatty acid have been rationally designed and investigated as levelers applied in copper electroplating. Surface tension and contact angle indicated the FAQAS's surfactivity and wettability were closely related to the length of hydrophobic chains. FAQAS 1 a–1 f displayed the capability to inhibit the copper deposition in CV tests and their inhibiting abilities agreed with the order of their surfactivity and wettability. Compound 1 e showed the best inhibition capability, and was comprehensively tested by field‐emission scanning electron microscopy (FE‐SEM), X‐ray photoelectron spectroscopy (XPS) and other electrochemical measurements. The strong inhibition ability of compound 1 e on copper electrodeposition could be attributed to its fast and strong absorption of 1 e on the cathode surface. Moreover, galvanostatic measurements (GMs) indicated that compound 1 e not only cause polarization but also has stable synergistic effects with other additives to form a convection dependent competitive adsorption layer. In addition, through‐hole (TH) electroplating experiments verified that uniform TH could be obtained on copper electrodeposition using the bath containing compound 1 e. This work may shed some light on the pratical application of surfactants as effective leveler in acid copper electroplating.

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Section: Resultsmentioning

confidence: 99%

Fatty Acid Quaternary Ammonium Surfactants Based on Renewable Resources as a Leveler for Copper Electroplating

Zhao

et al. 2019

ChemElectroChem

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“…The sidewalls of these holes were metalized by electroless copper after plasma treatment. Following that, the pretreatment techniques and electroplating procedures have been presented in detail elsewhere . Test boards were plated at a current density of 2.00 A dm −2 for 60 min at 25 °C in a haring cell with a 1.5 L working volume.…”

Section: Methodsmentioning

confidence: 99%

Low fractal dimension modified drilling‐hole wall for PTFE high‐frequency board copper plating with plasma treatment

Zhou

Gou

Jin

et al. 2019

J of Applied Polymer Sci

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The development of fifth generation communication has raised the demand of advanced polytetrafluoroethylene (PTFE) board in high-frequency signal transmission. Drilling holes are fabricated on PTFE substrate for subsequent copper plating to achieve interlayer electrical connection between the thin dielectric layers. In this article, we propose O 2 /CF 4 plasma treatment to clean the after-drilling PTFE hole, achieving highly activated surface for following copper plating. The plating results, in contrast with control experiments which were performed without plasma treatment, demonstrate multiple advantages of O 2 /CF 4 plasma treatment including qualified copper plating, excellent thermal shock reliability, and improved wettability. X-ray photoelectron spectroscopy analysis for plasma-treated samples confirms the emergence of hydrophilic groups such C O and COO/COF on PTFE hole wall. In addition, optimized parameters with particle gas flow combination and process time were obtained through parameter sweeping. The best qualified sample was associated with the lowest roughness (fractal dimension) of PTFE hole wall, indicating its promising application in high-frequency signal transmission in PTFE board.

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“…[15][16][17][18] Small molecule levelers with these characteristics, such as 4-amino-2,1,3-benzothiadiazole and 4,6-dimethyl-2mercaptopyrimidine (DMP), have appeared in previous reports. 19,20 However, they are still in the preliminary research phase and the mechanism of adsorption still remains unclear.…”

Section: Introductionmentioning

confidence: 99%

1-(4-Hydroxyphenyl)-2H-tetrazole-5-thione as a leveler for acid copper electroplating of microvia

et al. 2022

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4,6-Dimethyl-2-mercaptopyrimidine as a potential leveler for microvia filling with electroplating copper

Abstract: Filling performance of microvia was defined as following equation: η = (A/B) × 100%.

Cited by 38 publications

References 70 publications

Fatty Acid Quaternary Ammonium Surfactants Based on Renewable Resources as a Leveler for Copper Electroplating

Fatty Acid Quaternary Ammonium Surfactants Based on Renewable Resources as a Leveler for Copper Electroplating

Low fractal dimension modified drilling‐hole wall for PTFE high‐frequency board copper plating with plasma treatment

1-(4-Hydroxyphenyl)-2H-tetrazole-5-thione as a leveler for acid copper electroplating of microvia

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