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A series of novel hydroxylated cardanol quaternary ammonium salts (HCQAS 3a-3g) with one or two hydroxyl groups, derived from renewable cardanol, a plantbased and low-cost material natural cashew nut shell liquid (CNSL), have been rationally designed and investigated as additive in detergent. CMC, γ CMC , C 20 , pC 20 , and CMC/ C 20 were employed to exhibit the surface properties of HCQAS, reflecting that the surfactivity were superior to general cationic surfactants. In addition, HCQAS revealed excellent water solubility and wettability by krafft point and contact angle tests. Moreover, emulsifiability and foamability conversions were monitored versus time and volume of foam, respectively. Also, TEM micrographs were taken to provide the aggregation morphologies of HCQAS 3a aqueous solution at different concentration. Furthermore, HCQAS 3a and BGF-10 binary composite system as well as HCQAS 3a, BGF-10, and SDBS ternary composite system were investigated by CMC, γ CMC , emulsifiability, and foamability to determine the optimum molar ratio (HCQAS 3a: BGF-10: SDBS = 0.24:0.36:0.4), and then, analysis of morphology by TEM showed that the incorporation of HCQAS 3a, BGF-10, and SDBS in aqueous solution accelerated the formation of abundant vesicles with large volume and surface area. Finally, a green concentrated detergent was designed and prepared with the filtered ratio, where the presence of vesicles greatly enhanced detergency to promisingly replace the familiar use of petroleum-based TX-10 in detergent. This study on the structure and performance of HCQAS may shed some light on the development of novel environmentally friendly surfactant.

A series of fatty acid quaternary ammonium surfactants (FAQAS 1 a–1 f) derived from renewable resource of fatty acid have been rationally designed and investigated as levelers applied in copper electroplating. Surface tension and contact angle indicated the FAQAS's surfactivity and wettability were closely related to the length of hydrophobic chains. FAQAS 1 a–1 f displayed the capability to inhibit the copper deposition in CV tests and their inhibiting abilities agreed with the order of their surfactivity and wettability. Compound 1 e showed the best inhibition capability, and was comprehensively tested by field‐emission scanning electron microscopy (FE‐SEM), X‐ray photoelectron spectroscopy (XPS) and other electrochemical measurements. The strong inhibition ability of compound 1 e on copper electrodeposition could be attributed to its fast and strong absorption of 1 e on the cathode surface. Moreover, galvanostatic measurements (GMs) indicated that compound 1 e not only cause polarization but also has stable synergistic effects with other additives to form a convection dependent competitive adsorption layer. In addition, through‐hole (TH) electroplating experiments verified that uniform TH could be obtained on copper electrodeposition using the bath containing compound 1 e. This work may shed some light on the pratical application of surfactants as effective leveler in acid copper electroplating.

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