47-2:Invited Paper: Oxide/Organic Semiconductor Electronics on Plastic Substrates for Flexible AMOLED Displays

Abstract

Emerging flexible OLED display technologies are expected to bring a new viewing experience to a wide range of display applications from mobile terminals and signage to large-area sheet-type displays. For large-area and high-resolution flexible OLED displays, however, the development of high-performance and reliable TFT backplanes on plastic substrates is still an essential and challenging research subject. Here, we discuss our recent work on the development of oxide TFTs and their application to flexible OLED displays. In addition, solution-based organic materials and devices, which are advantageous for the simple fabrication of large-area backplanes, are discussed.

53‐1: The foldable display architecture technique depending on the wide temperature range and the folding curvature

“…To solve this problem, chemically the thermo-stability of OCA molecule is improved or we have to effectively control the mechanical performance of OCA material such as Creep & Recovery. [10,[14][15][16]17] Especially, the modulus of OCA is sensitively reacted with temperature changes. The modulus of general acrylic OCA is significantly increased with decreasing temperature.…”

“…As a result, the proper OCA properties are empirically defined from folding simulation and experimental test results. [11][12][13][14][15] We consider three kinds of folding environment. One is the difference of mechanical folding stress distribution between high modulus OCA applied foldable module and low modulus OCA applied foldable module; Second is the temperaturedependent stress alternation of foldable display stack structure between room temperature and low temperature; the other one is the folding stress depending on reduction of folding radius.…”

Effect of Interlayer Stress on U Bends and Water Droplet Bends

“…Each functional lm layer contains only one layer of rstorder solid elements, which will result in a larger calculation error caused by the clipping self-lock e ect. erefore, it is di cult to simulate the transmission of pressure between functional lm layers [5]. In this paper, a hyperelastic model of OCA is proposed.…”