The next generation of collider experiments require tracking
detectors with extreme performance capabilities in terms of spatial
resolution (tens of µm), radiation hardness
(1017 1 MeV neq/cm2) and timing resolution (tens of
ps). 3D silicon sensors, recently developed within the TimeSPOT
initiative, offer a viable solution to cope with such demanding
requirements. In order to accurately characterize the timing
performance of these new sensors, several read-out boards, based on
discrete active components, have been designed, assembled, and
tested. The same electronics is also suitable for characterization
of similar pixel sensors whenever timing performance in the order
and below 10 ps is a requirement. This paper describes the general
characteristics needed by front-end electronics to exploit
solid-state sensors with fast timing capabilities and in particular,
showcases the performance of the developed electronics in the
testing and characterization of fast 3D silicon sensors.