2019
DOI: 10.1038/s41566-019-0556-6
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4H-silicon-carbide-on-insulator for integrated quantum and nonlinear photonics

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Cited by 378 publications
(296 citation statements)
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References 42 publications
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“…Si color center in 4H-SiC (abbreviated V Si henceforth), and find the V Si to satisfy these requirements. The V Si is a color center with promise for quantum information processing technologies due to its long spin coherence time 35 , unique 3/2 spin system 36,37 , and compatibility with scalable photonic architectures 38 . The V Si spectrum comprises two optical transitions, which are separated by 1 GHz via spin-spin coupling (corresponding to spin ±1/2 and ±3/2 sublevels).…”
Section: Continuous-wave Scattering Off a Modulated Two-level Systemmentioning
confidence: 99%
“…Si color center in 4H-SiC (abbreviated V Si henceforth), and find the V Si to satisfy these requirements. The V Si is a color center with promise for quantum information processing technologies due to its long spin coherence time 35 , unique 3/2 spin system 36,37 , and compatibility with scalable photonic architectures 38 . The V Si spectrum comprises two optical transitions, which are separated by 1 GHz via spin-spin coupling (corresponding to spin ±1/2 and ±3/2 sublevels).…”
Section: Continuous-wave Scattering Off a Modulated Two-level Systemmentioning
confidence: 99%
“…We develop an alternative etch recipe to that based on XeF 2 (conventional) due to the availability of process gases and compatibility with standard ICP-RIE chambers. Specifically we use a combination of SF 6 and H 2 in the chamber at high pressure with zero RF bias ( Fig. 1(i)).…”
Section: Fabrication Methodsmentioning
confidence: 99%
“…Cubic silicon carbide (3C-SiC) has been gaining momentum as a platform to realize many optical functionalities due to its diverse properties. For example, the large second order ( χ2) susceptibility of 34 pm/V [3] and high third order non-linearity ( χ3) [4,5] allows for electro-optic applications and efficient non-linear optical frequency conversion [6]. SiC is a CMOS compatible material [7,8] with several favorable properties such as a wide band-gap [9], absence of two photon absorption at telecom wavelengths [10], high chemical resistance in harsh environments [11], high optical power handling [12], low thermo-optic coefficient [13], high thermal conductivity and large Young's modulus of 450 GPa [14].…”
Section: Introductionmentioning
confidence: 99%
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“…Both 3C and 4H SiC can be achieved on insulator (SiCOI), based on direct wafer bonding rather than smart cut techniques and thinning of the material, methods now developed at the wafer-scale level. Recent experiments on wafer bonding of 3C on Insulator have provided microdisks with Q=143 000 [138], while in 4H integrated circuits such as micro-ring resonators [168] with a Q=73 000, photonic crystal nanocavities [182] with Q=630 000, and photonics waveguides [183]. Direct wafer bonding holds the promises to improve the final Q and optical quality of the resonators and be able to provide an integrated platform for nonlinear photonics and integrated quantum circuits in SiC.…”
Section: Nanophotonicsmentioning
confidence: 99%