5-(Phenyl)-4H-1,2,4-triazole-3-thiol as a corrosion inhibitor for copper in 3.5% NaCl solutions

Sherif, El‐Sayed M.; El-Shamy, A. M.; Ramla, Mostafa M.; Nazhawy, Ahmed O.H. El

doi:10.1016/j.matchemphys.2006.12.009

Cited by 112 publications

(54 citation statements)

References 31 publications

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“…7 [32,33]. On the other hand, the anodic reaction at the same condition is the dissolution of copper as has been reported in our previous study [16][17][18]. The increase of the immersion time of Cu to 50 h in NaCl solution without inhibitor, Fig.…”

Section: Potentiodynamic Polarization Measurementssupporting

confidence: 74%

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Surface protection of copper in aerated 3.5% sodium chloride solutions by 3-amino-5-mercapto-1,2,4-triazole as a copper corrosion inhibitor

Sherif

Almajid

2010

J Appl Electrochem

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Surface protection of copper in aerated 3.5% NaCl solutions by 3-amino-5-mercapto-1,2,4-triazole (AMTA) has been reported. The study has been carried out using weight loss, pH, potentiodynamic polarization (PDP), electrochemical impedance spectroscopy (EIS), and chronoamperometric (CA) measurements along with scanning electron microscopy (SEM) and energy dispersive X-ray (EDS) investigations. Weight-loss data indicated that the dissolution rate and the pH of the solution decreased to a minimum after 24 days of copper immersion due to the inhibitive action of AMTA. PDP, CA, and EIS measurements showed that AMTA decreased the corrosion rates and increased the polarization resistance and inhibition efficiency. This effect was increased with increasing AMTA concentration as well as the immersion time of the copper electrode to 50 h before measurements. SEM micrograph and EDS analysis proved that the inhibition of copper corrosion takes place due to adsorption of AMTA onto the surface. These results together confirmed that AMTA is a good mixed-type inhibitor and the inhibition of copper corrosion is achieved by strong adsorption of AMTA molecules.

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Section: Potentiodynamic Polarization Measurementssupporting

confidence: 74%

“…This is explained by the presence of vacant d orbital in copper atoms that forms coordinative bonds with atoms that are able to donate electrons [3-6, 8-10, 15-19]. Interaction with rings containing conjugated bonds, p electrons, is also present [15][16][17][18][19][20][21][22][23].…”

Section: Introductionmentioning

confidence: 99%

Surface protection of copper in aerated 3.5% sodium chloride solutions by 3-amino-5-mercapto-1,2,4-triazole as a copper corrosion inhibitor

Sherif

Almajid

2010

J Appl Electrochem

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“…The maximum standard deviation in the observed weight loss was calculated to be ±1.0%. The weight loss (Dm, mg dm -2 ), the corrosion rate (R Corr , mg dm -2 day -1 (mdd)), the inhibition efficiency (IE%), and the degree of surface coverage (h) over the exposure time were calculated as follows [6,7],…”

Section: Gravimetric Methodsmentioning

confidence: 99%

“…In previous work, the corrosion reactions of copper [1] were reported, while the effects of organic additives on corrosion inhibition of both copper [2][3][4][5][6][7][8][9][10] and aluminum [11,12] were studied in different corrosive environments. A variety of electrochemical and gravimetric techniques were used, together with surface characterization methods such as XPS, AES, SEM, EDX, FT-IR, UV-vis and Raman spectroscopy.…”

Section: Introductionmentioning

confidence: 99%

Inhibition of corrosion processes on copper in aerated sodium chloride solutions by 5-(3-aminophenyl)-tetrazole

2008

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Inhibition of corrosion processes of copper in aerated 3.5% NaCl solutions by 5-(3-aminophenyl)-tetrazole (APT) has been investigated using open-circuit potential, potentiodynamic polarization, potentiostatic current-time, electrochemical impedance spectroscopy, and weight loss measurements together with pH and Raman spectroscopy. Increasing concentrations of APT greatly decreased the corrosion rate and increased the surface and polarization resistance. It was concluded that the adsorption of APT blocks the active sites on the copper surface leading to the formation of cuprous chloride and oxychloride complexes. This was supported by the Raman spectrum obtained from the copper surface after 24 days of immersion in a 3.5% NaCl solution containing 5.0 mM APT. The results collectively are in good agreement and show clearly that APT is a good corrosion inhibitor for copper under the conditions studied.

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“…Moreover, nontoxic compounds which can be used as potent inhibitors should contain heteroatoms which have strong affinity to specific metals or a ring with delocalized electrons. Nevertheless, the presence of a ring with delocalized electrons in the inhibitor structure also enables and facilitates the adsorption of the examined compounds on the metal or alloy surface [24][25][26][27][28]. Cysteine (Cys) is a very interesting amino acid due to the amino group in its structure and -SH group that has strong affinity to copper (Figure 1).…”

Section: Introductionmentioning

confidence: 99%

Protection of Brass in HCl Solution by L‐Cysteine and Cationic Surfactant

Radovanović

Tasić

Mihajlović

et al. 2018

Advances in Materials Science and Engineering

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Electrochemical behavior of brass and inhibitory effect of L-cysteine in HCl solution are investigated using electrochemical techniques in addition to SEM-EDS analysis. Results show that inhibition efficiency depends on inhibitor concentration and immersion time of brass electrode in inhibitor solution. Electrochemical test results point to formation of Cu(I)-cysteine complex on the brass surface in chloride solutions with addition of different amounts of cysteine. e formed complex has an important role in inhibition of the corrosion process in the examined media because Cu(I)-cysteine significantly reduces dissolution of brass. Curves obtained in acidic solution in the presence of cysteine after pretreatment in sodium dodecyl sulfate (SDS) by cyclic measurements and potentiodynamic polarization measurements indicate intense inhibition of corrosion processes. Efficient inhibition of brass dissolution is result of formation of a stable protective layer on the brass surface after pretreatment of the electrode in SDS solution. e brass surface is modified in sodium dodecyl sulfate solution in order to increase cysteine adsorption on the electrode surface and to improve inhibition efficiency. Inhibition mechanism of cysteine includes adsorption on active sites on the electrode surface, which is confirmed by SEM-EDS analysis of brass. Adsorption of cysteine in hydrochloric acid solution obeys the Langmuir adsorption isotherm. Also, Gibbs free energy of adsorption has a value of −31.5 kJ/mol and indicates strong adsorption of cysteine on the electrode surface.

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5-(Phenyl)-4H-1,2,4-triazole-3-thiol as a corrosion inhibitor for copper in 3.5% NaCl solutions

Cited by 112 publications

References 31 publications

Surface protection of copper in aerated 3.5% sodium chloride solutions by 3-amino-5-mercapto-1,2,4-triazole as a copper corrosion inhibitor

Surface protection of copper in aerated 3.5% sodium chloride solutions by 3-amino-5-mercapto-1,2,4-triazole as a copper corrosion inhibitor

Inhibition of corrosion processes on copper in aerated sodium chloride solutions by 5-(3-aminophenyl)-tetrazole

Protection of Brass in HCl Solution by L‐Cysteine and Cationic Surfactant

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