51 GHz frontend with flip chip and wire bond interconnections from GaAs MMICs to a planar patch antenna

Baumann, G.; Richter, H.J.; Baumgartner, A.; Ferling, Dieter; Heilig, R.; Hollmann, D.; Muller, H.; Nechansky, H.; Schlechtweg, M.

doi:10.1109/mwsym.1995.406291

Cited by 39 publications

(12 citation statements)

References 7 publications

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“…Experimental [5], [6] and numerical [3], [7], [8] characterization typically neglect the variation in wire bond parameters such as the loop height or assume a particular configuration. In this paper, a comprehensive characterization of wire bond interconnects on air connecting two microstrip lines as a function of lengths, loop heights (tight and loose loops) and bond types (ball-crescent and wedge) is presented.…”

Section: Introductionmentioning

confidence: 99%

Experimental modeling, repeatability investigation and optimization of microwave bond wire interconnects

Sutono¹,

Cafaro

Laskar

et al. 2001

IEEE Trans. Adv. Packag.

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Abstract-We present the first comprehensive experimental characterization of bond wire interconnects at microwave frequencies which includes a repeatability study, modeling and optimization. Wire bond interconnects with two different bond types (ball-crescent and wedge), two different loop types (tight and loose) and two different lengths (15 and 25 mils), were fabricated and experimentally investigated. We report the performance and repeatability comparison of these configurations and develop an electromagnetic as well as a simple wide band lumped-element equivalent circuit model to 40 GHz. A novel ribbon bond interconnect topology has also been proposed and experimentally tested demonstrating 65% less reflection compared to the conventional bond wire or ribbon configuration.

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Section: Introductionmentioning

confidence: 99%

Experimental modeling, repeatability investigation and optimization of microwave bond wire interconnects

Sutono¹,

Cafaro

Laskar

et al. 2001

IEEE Trans. Adv. Packag.

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“…It is not advisable to use bond wires to connect the chip operating at 32 GHz to the antennas due to their high parasitic inductance. Therefore the pads are prepared for flip-chip mounting by solder bumps [6]. Due to the small number of samples a single ball bumping technique was used.…”

Section: Layout Of the Mmicmentioning

confidence: 99%

Compact doppler sensor operating at 31-32 GHz using a SiGe HBT MMIC and patch antennas

Abele

Trasser

Schad

et al.

Digest of Papers. 2004 Topical Meeting onSilicon Monolithic Integrated Circuits in RF Systems, 2004.

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This paper describes a compact Doppler sensor consisting of a SiGe MMIC and patch antennas for transmitting and receiving. The MMIC has a differential oscillator operating at 31-32 GHz and a single balanced Gilbert cell mixer. For the differential oscillator lumped elements are used and the Gilbert cell mixer serves two purposes. First it generates the difference frequency of the transmitted and received signal, secondly it lets the rf-signal pass. This results in a total chip size of only 380x770µm 2 .On the microwave laminate substrate TMM3 patch antennas are realized, one for receiving and two for transmitting. The pads for the MMIC are prepared with solder bumps. This way the MMIC can be flip-chip mounted to the substrate of the patch antennas resulting in low losses at the interconnects.

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“…Interconnections between circuits may have significant impact on the whole system and thus a number of studies have been performed on the electromagnetic characteristics of interconnections [ 1-41. Bond wire interconnections are most commonly used in the microwave and millimeter-wave circuits. However, bond wire parasitic inductance gives substantial loss especially at high fiequencies [2]. Flip chip interconnections have much shorter length than bond wire, so they are expected to be a better solution at higher frequencies.…”

Section: Introductionmentioning

confidence: 99%

“…Flip chip interconnections have much shorter length than bond wire, so they are expected to be a better solution at higher frequencies. Although they have been only recently studied at high frequencies, theoretical and experimental studies have shown good performances of flip chip interconnections [1,2].…”

Section: Introductionmentioning

confidence: 99%

A novel broadband flip chip interconnection

Kim¹,

Koh²,

Itoh³

Electrical Performance of Electronic Packaging

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51 GHz frontend with flip chip and wire bond interconnections from GaAs MMICs to a planar patch antenna

Cited by 39 publications

References 7 publications

Experimental modeling, repeatability investigation and optimization of microwave bond wire interconnects

Experimental modeling, repeatability investigation and optimization of microwave bond wire interconnects

Compact doppler sensor operating at 31-32 GHz using a SiGe HBT MMIC and patch antennas

A novel broadband flip chip interconnection

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