6-in-1 Silicon carbide power module for high performance of power electronics systems

Ishino, H.; Watanabe, Tomokazu; Sugiura, Kazuhiko; Tsuruta, Kazuhiro

doi:10.1109/ispsd.2014.6856072

Cited by 41 publications

(13 citation statements)

References 2 publications

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“…To investigate the advantages of WBG devices, Denso developed a SiC-based 6-in-1 module composed of six switches to form a voltage source inverter, which features extremely high efficiency and power density, as shown in Fig.9 [66]. Compared to the Si-based inverter, using SiC MOSFETs requires further design care to reduce the stray inductance within the module.…”

Section: Toyota and Densomentioning

confidence: 99%

“…By using magnetic cancellation techniques, a low inductance of 10.6nH can be achieved, which reduced the voltage spike by 70% during the switching test. To verify its performance, a 70 kW air-cooled prototype inverter was constructed and measured to have an extremely high power density of 100kW/L, and an efficiency of over 99% [66]. In 2015, Toyota began on-road testing with the Toyota Camry that features a SiC inverter.…”

Section: Toyota and Densomentioning

confidence: 99%

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Automotive Power Module Packaging: Current Status and Future Trends

et al. 2020

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Semiconductor power modules are core components of power electronics in electrified vehicles. Packaging technology often has a critical impact on module performance and reliability. This paper presents a comprehensive review of the automotive power module packaging technologies. The first part of this paper discusses the driving factors of packaging technology development. In the second section, the design considerations and a primary design process of module packaging are summarized. Besides, major packaging components, such as semiconductor dies, substrates, and die bonding, are introduced based on the conventional packaging structure. Next, technical details and innovative features of state-of-the-art automotive power modules from major suppliers and original equipment manufacturers are reviewed. Most of these modules have been applied in commercial vehicles. In the fourth part, the system integration concept, printed circuit board embedded packaging, three-dimensional packaging, press pack packaging, and advanced materials are categorized as promising trends for automotive applications. The advantages and drawbacks of these trends are discussed, and it is concluded that a preferable overall performance could be achieved by combining multiple technologies. INDEX TERMS Electric vehicles, power electronics, semiconductor device packaging TABLE I PRIMARY DESIGN CONSIDERATIONS OF MODULE PACKAGING Design considerations Details Size Volume, weight, power density, energy density. Electrical performance Current rating, voltage rating, switching frequency range, power loss, electrical insulation, electromagnetic interference (EMI). Thermal management Temperature distribution, thermal resistance (Rth), heat capacity, coefficient of thermal expansion (CTE). Mechanical strength Thermal stress distribution, material properties (Tensile strength, flexural strength, peel strength, etc.), external shock and vibration. Reliability and fatigue Joints failure, crack propagation, delamination, lifetime under temperature and power cycling. Manufacturability and assembly Manufacture procedure, process temperature and pressure, external connections.

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Section: Toyota and Densomentioning

confidence: 99%

Section: Toyota and Densomentioning

confidence: 99%

Automotive Power Module Packaging: Current Status and Future Trends

et al. 2020

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“…Current paths between the chips were also configured to be in opposite directions. A parasitic inductance of 7.5 nH was obtained [53].…”

Section: Packaging Techniques For Sic Power Modulementioning

confidence: 99%

Review of Packaging Schemes for Power Module

Hou

Wang²,

Cao

et al. 2020

IEEE J. Emerg. Sel. Topics Power Electron.

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SiC devices are promising for outperforming Si counterparts in high-frequency applications due to its superior material properties. Conventional wirebonded packaging scheme has been one of the most preferred package structures for power modules. However, the technique limits the performance of a SiC power module due to parasitic inductance and heat dissipation issues that are inherent with aluminum wires. In this article, low parasitic inductance and high-efficient cooling interconnection techniques for Si power modules, which are the foundation of packaging methods of SiC ones, are reviewed first. Then, attempts on developing packaging techniques for SiC power modules are thoroughly overviewed. Finally, scientific challenges in the packaging of SiC power module are summarized.

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“…However, the typical thickness of copper in a DBC substrate has been limited to around 0.5 mm due to production difficulties [12]. Hence, a substrate sandwich structure called a double-sided 2 of 15 cooling package has also been developed to expand the cooling area [13][14][15][16] to cover a small area of cooling in a single-sided DBC assembly. However, many difficulties in manufacturing double-sided cooling structures still remain.…”

Section: Introductionmentioning

confidence: 99%

Degradation Mechanism of Pressure-Assisted Sintered Silver by Thermal Shock Test

et al. 2021

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This paper investigates the degradation mechanism of pressure-sintered silver (s-Ag) film for silicon carbide (SiC) chip assembly with a 2-millimeter-thick copper substrate by means of thermal shock test (TST). Two different types of silver paste, nano-sized silver paste (NP) and nano-micron-sized paste (NMP), were used to sinter the silver film at 300 °C under a pressure of 60 MPa. The mean porosity (p) of the NP and MNP s-Ag films was 2.4% and 8%, respectively. The pore shape of the NP s-Ag was almost spherical, whereas the NMP s-Ag had an irregular shape resembling a peanut shell. After performing the TST at temperatures ranging from −40 to 150 °C, the scanning acoustic tomography (SAT) results suggested that delamination occurs from the edge of the assembly, and the delamination of the NMP s-Ag assembly was faster than that of the NM s-Ag assembly. The NMP s-Ag assembly showed a random delamination, indicating that the delamination speed varies from place to place. The difference in fracture mechanism is discussed based on cross-sectional scanning electron microscope (SEM) observation results after TST and plastic strain distribution results estimated by finite element analysis (FEA) considering pore configuration.

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6-in-1 Silicon carbide power module for high performance of power electronics systems

Cited by 41 publications

References 2 publications

Automotive Power Module Packaging: Current Status and Future Trends

Automotive Power Module Packaging: Current Status and Future Trends

Review of Packaging Schemes for Power Module

Degradation Mechanism of Pressure-Assisted Sintered Silver by Thermal Shock Test

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