2017
DOI: 10.1109/tthz.2017.2710632
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850 GHz Receiver and Transmitter Front-Ends Using InP HEMT

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Cited by 65 publications
(24 citation statements)
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“…Since the first report of extrapolated f max of InGaAs/InAlAs/InP HEMT with 35 nm gate exceeding the 1 THz limit [76], similar parameters were achieved for a 20 nm metamorphic HEMT technology [77] and the f max of 1.3 THz for an extended drain-side recess structure in 75 nm gate InAlAs/InGaAs HEMTs [78]. Although currently available just in a few places worldwide, such technologies are starting to be named as Terahertz Monolithic Integrated Circuits (TMICs) and, by now, have proven to be able to produce efficient frequency multipliers for 500 GHz [79] or 670 GHz [80], mixers for 600 GHz [81], low noise amplifiers for 600 GHz band [82][83][84], and transmitters and receivers for 850 GHz [85] with the record report of achieved amplification up to 8 dB at 1 THz [86].…”
Section: High Electron Mobility Transistor-based Sourcesmentioning
confidence: 99%
“…Since the first report of extrapolated f max of InGaAs/InAlAs/InP HEMT with 35 nm gate exceeding the 1 THz limit [76], similar parameters were achieved for a 20 nm metamorphic HEMT technology [77] and the f max of 1.3 THz for an extended drain-side recess structure in 75 nm gate InAlAs/InGaAs HEMTs [78]. Although currently available just in a few places worldwide, such technologies are starting to be named as Terahertz Monolithic Integrated Circuits (TMICs) and, by now, have proven to be able to produce efficient frequency multipliers for 500 GHz [79] or 670 GHz [80], mixers for 600 GHz [81], low noise amplifiers for 600 GHz band [82][83][84], and transmitters and receivers for 850 GHz [85] with the record report of achieved amplification up to 8 dB at 1 THz [86].…”
Section: High Electron Mobility Transistor-based Sourcesmentioning
confidence: 99%
“…It can be seen that all the three technologies can provide output powers up to the milliwatt (mW) threshold in the 300 GHz-band (∼ 275-325 GHz [39]), while both UTC-PD and RTD-based emitters have also demonstrated to work well above 600 GHz, and above 1 THz with associated RF power of up to few microwatt (µW). Indeed, TMICs oscil- lators have shown to work at ∼ 300 GHz in the fundamental mode [40], ∼ 430 GHz in the second harmonic [41], and ∼ 540 GHz in the third harmonic [42], and with operation frequencies of 1 THz and mW output powers in the 0.3-0.9 THz range only enabled by extremely complex Tx designs, including frequency multiplier chains, push-push operation, sub-harmonic amplification stages, and array configurations [43]- [48], while RTD oscillators do not require any of these and are characterised by uncomplex circuit topologies, which drastically reduces production cost and increases integrability. Fig.…”
Section: Introductionmentioning
confidence: 99%
“…Currently, a better option may then be to use indium-phosphide (InP) technology for the highest frequency parts, combined with a silicon complementary metal-oxide-semiconductor-driven baseband circuit. Amplifiers and mixers at 800 GHz have been demonstrated in 25-nm InP high-electron-mobility transistor (HEMT) technology with fmax of 1.5 THz [189]. When 5-nm SiGe technology becomes available, the level of integration will be higher, resulting in reduced production costs.…”
Section: Rf Transceiver Challenges and Possibilitiesmentioning
confidence: 99%