Nanoparticles of Au, Pd, and Pt form spontaneously as thin, morphologically complex metallic films upon various semiconducting or metal substrates such as Ge(100), Cu, Zn, and Sn, via galvanic displacement from aqueous metal salt solutions. Patterning of these high surface area metal films into ordered structures utilizing photolithography, microcontact printing (µ-CP), and dip-pen nanolithography (DPN) is demonstrated on flat Ge(100), and (for µ-CP) on rough Zn foil.There is presently enormous interest in patterning surfaces with micro-and nanometer resolution for both fundamental investigations and technological applications.1 Recent developments, such as dip-pen nanolithography (DPN) 2 and microcontact printing (µ-CP), 1 employ a liquid-phase "ink" to pattern a solid "paper" substrate. Established inks for DPN and µ-CP include thiols, 2 DNA, 3 polymers, 4 proteins, 5,6 hexamethyldisilazane, 7 alkylsiloxanes, 8 palladium colloids, 9 sols (Al, Si, Sn oxides), 10 metal complexes, 11 and gold. 12 In this paper, we demonstrate that Au, Pd, and Pt nanoparticle films, produced through a spontaneous electroless deposition reaction, are amenable to patterning via photolithography, µ-CP, and DPN. Because many properties of the Au, Pd, and Pt nanoparticle films, including film thickness, particle size, and roughness, can be controlled, 13 Figure 1. Deposition proceeds via galvanic displacement 20 in the absence of fluoride, pH buffers, complexing agents, or external reducing agents, in contrast to earlier work. 21-30 Patterning of these particle film assemblies is essential for their subsequent incorporation into higher order architectures and devices. 31,32 The first patterning motif tested, photolithography, was carried out as outlined in Figure 2a. Approximately 0.1 mL of neat dodecene was applied to a 1 cm 2 hydride-terminated Ge(100) surface, which was subequently exposed to 254 nm UV light (9 mW cm -2 intensity) through a metal grid contact mask under an inert atmosphere. 33 The illuminated regions undergo hydrogermylation at room temperature within thirty minutes. A related functionalization approach has been shown on silicon.34 This leads to spatially defined 5-25 µm-sized domains of dodecyl and hydride. Immersion of the hydride/alkyl surface into aqueous noble metal salt solutions results in preferential deposition in the hydride areas since the alkyl monolayer functions as an effective dielectric barrier (Figure 3). The hydride surface oxidizes in-situ and subsequently dissolves in the aqueous medium. Metal salt reduction and deposition can then occur, leading to metallization between the alkylated domains. In this case, the germanium oxide dissolves in water, 35 leading to intimate electrical contact between the semiconductor bulk and the metal salts and affording a faster rate of deposition. In the case of silicon, however, this approach is not feasible because the native oxide has been shown to effectively prevent metal deposition due to its insolubility in water. 20 Attempts to use spatially define...