2012 IEEE International Solid-State Circuits Conference 2012
DOI: 10.1109/isscc.2012.6177063
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A 1920×1080 3.65μm-pixel 2D/3D image sensor with split and binning pixel structure in 0.11pm standard CMOS

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Cited by 23 publications
(24 citation statements)
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“…In light of these benefits, research in single-chip RGBD is an emerging area. Our results compare well to the previous papers on single-sensor RGBD imaging, where in [15] spatial resolution is sacrificed and in [18] the acquisition is not real time.…”
Section: 1s 0ssupporting
confidence: 87%
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“…In light of these benefits, research in single-chip RGBD is an emerging area. Our results compare well to the previous papers on single-sensor RGBD imaging, where in [15] spatial resolution is sacrificed and in [18] the acquisition is not real time.…”
Section: 1s 0ssupporting
confidence: 87%
“…In terms of color, the ToF camera in [18] time multiplexes red green and blue LEDs, but the technique is for static scenes. Recently, Kim et al [15] report the first real-time color RGBD sensor, by redesigning the silicon sensor to multiplex both color and depth pixels (this decreases the depth pixel count by a factor of 4). Time of flight technology is of interest to the broader community beyond range imaging; see recent work in ultrafast imaging [24,13,11,33,12], BRDF acquisition [19], multi-path imaging [13], [3], [2], and looking around corners [32].…”
Section: Related Workmentioning
confidence: 99%
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“…The proposed approach has the advantage of a better MTF compared to [KYO12], where RGB pixels are separated from an additional range pixel. The approach presented in [KKK12], however, is quite similar to this one. Here 8 pixels, that may work in colour mode, can be binned to yield range measurements by the continuously modulated principle (CW).…”
Section: Alternative Tof-ldpd Conceptmentioning
confidence: 96%
“…Recently, a sensor family has been proposed to achieve a compact pixel capable of 2D/3D imaging simultaneously, whereas one 3D pixel is obtained from 16 2D pixels using a so-called hierarchical binning strategy [33]. The sensor thus achieves 1920x1080 pixel resolution in 2D and 480x270 in 3D; it uses a pinned photodiode structure in standard 0.11µm CIS process operating at 20MHz with a centimetric depth resolution at a range of 4.5m.…”
Section: Single-chip Tof Sensorsmentioning
confidence: 99%