2023
DOI: 10.1109/jlt.2022.3222192
|View full text |Cite
|
Sign up to set email alerts
|

A 20–43.5-GHz Wideband Tunable Silicon Photonic Receiver Front-End for mm-wave Channel Selection/Jammer Rejection

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1

Citation Types

0
3
0

Year Published

2023
2023
2024
2024

Publication Types

Select...
4
1
1

Relationship

0
6

Authors

Journals

citations
Cited by 11 publications
(3 citation statements)
references
References 33 publications
0
3
0
Order By: Relevance
“…6(a), the mm-wave Si-PIC RAU was fabricated using the AMF CMC SOI Si-PIC process. A 780-um thick chip is thinned down to 78-um to reduce thermal cross-talk [17].…”
Section: Fabrication and Measurement Resultsmentioning
confidence: 99%
See 2 more Smart Citations
“…6(a), the mm-wave Si-PIC RAU was fabricated using the AMF CMC SOI Si-PIC process. A 780-um thick chip is thinned down to 78-um to reduce thermal cross-talk [17].…”
Section: Fabrication and Measurement Resultsmentioning
confidence: 99%
“…5, each PIC is optimized for the system specification required by either the downlink/uplink. Both PICs utilize silicon (Si) substrates with buried oxide (BOX) constituting the SOI substrate as indicated in [17]. In this section, we discuss the filter design for PICs and their usage in both downlink and uplink paths.…”
Section: Photonic Circuit Designmentioning
confidence: 99%
See 1 more Smart Citation