A 256×256 time-of-flight image sensor based on center-tap demodulation pixel structure

Chen, Zhe; Di, Shan; Cao, Z.; Qin, Qi; Ji, Fei; Liu, Liyuan; Wu, Nanjian

doi:10.1007/s11432-015-5453-0

Cited by 7 publications

(3 citation statements)

References 13 publications

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“…In comparison with charge coupled devices (CCDs), CMOS image sensors (CISs) [1][2][3][4][5] have a lot of advantages, such as better electro-optical performance, lower power consumption, and higher tolerance to the radiation environment. Due to such good performances, CISs are now widely used in star tracking, medical imaging, space remote sensing, and other scientific fields.…”

Section: Introductionmentioning

confidence: 99%

Modeling dark signal of CMOS image sensors irradiated by reactor neutron using Monte Carlo method

Xue

Wang

Chen

et al. 2018

Sci. China Inf. Sci.

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The dark signal degradation of the CMOS image sensor (CIS) was induced by neutron radiation, and it was modeled by Geant4, which is a three-dimensional Monte Carlo code. The simplified model of the CIS array was established according to the actual pixel geometry, material, and doping concentration. Nuclear elastic interaction and capture interaction were included in the physical processes, and the displacement damage dose in the space charge region of the pixel was calculated. The mean dark signal and dark signal distribution were modeled using Geant4, and the physical mechanisms were analyzed. The modeling results were in good agreement with the experimental and theoretical results.

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Section: Introductionmentioning

confidence: 99%

Modeling dark signal of CMOS image sensors irradiated by reactor neutron using Monte Carlo method

Xue

Wang

Chen

et al. 2018

Sci. China Inf. Sci.

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show abstract

“…Image sensors have been rapidly developed for decades and widely used in many different fields [1,2]. To achieve high resolution, the pixel size has been scaled down to 1 µm for mass production [3].…”

Section: Dear Editormentioning

confidence: 99%

A centripetal collection image sensor (CCIS) based on back gate modulation achieving 1T submicron pixel

Liu

et al. 2021

Sci. China Inf. Sci.

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“…Although the 3D vision system based on two image sensors has been developed, the system needs two image sensors and is complex. Recently the 2D/3D image sensors have been reported [47,48]. These sensors are based on the time-of-light (TOF) principle.…”

Section: Future Neuromorphic Vision Chipsmentioning

confidence: 99%

Neuromorphic vision chips

2018

Sci. China Inf. Sci.

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The paper reviews the progress of neuromorphic vision chip research in decades. It focuses on two kinds of the neuromorphic vision chips: frame-driven (FD) and event-driven (ED) vision chips. The FD and ED vision chips are very different from each other in system architecture, image sensing, image information coding, image processing algorithm, design methodology. The vision chips can overcome serial data transmission and processing bottlenecks in traditional image processing systems. They can perform the high speed image capture and real-time image processing operations. This paper selects two typical chips from the two kinds of vision chips, respectively, and introduces their architectures, image sensing schemes, image processing processors and system operation. The FD neuromorphic reconfigurable vision chip comprises a high speed image sensor, a processing element array and self-organizing map neural network. The FD vision chip has the advantages in image resolution, static object detection, time-multiplex image processing, and chip area. The ED neuromorphic vision chip system is based on address-event-representation image sensor and event-driven multi-kernel convolution network. The ED vision chip has the advantages in fast sensing, low communication bandwidth, brain-like processing, and high energy efficiency. Finally, this paper discusses the architecture and the challenges of the future neuromorphic vision chip and indicates that the reconfigurable vision chip with left-and right-brain functions integrated in the three dimensional (3D) large-scale integrated circuit (LSI) technology becomes a trend of the research on the vision chip.

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A 256×256 time-of-flight image sensor based on center-tap demodulation pixel structure

Cited by 7 publications

References 13 publications

Modeling dark signal of CMOS image sensors irradiated by reactor neutron using Monte Carlo method

Modeling dark signal of CMOS image sensors irradiated by reactor neutron using Monte Carlo method

A centripetal collection image sensor (CCIS) based on back gate modulation achieving 1T submicron pixel

Neuromorphic vision chips

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