A 256 Pixelated SPAD readout ASIC with in-Pixel TDC and embedded digital signal processing for uniformity and skew correction

Nolet, F.; Lemaire, William; Dubois, Frédérik; Roy, N.; Carrier, Simon; Samson, Arnaud; Charlebois, Serge A.; Fontaine, R.; Pratte, J.‐F.

doi:10.1016/j.nima.2019.162891

Cited by 22 publications

(34 citation statements)

References 36 publications

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“…When performing single-photon counting with analog SiPMs, these fluctuations blur the spectrum at high photon counts. With a PDC, each triggered SPAD raises a flag processed by the digital logic [ 41 , 42 , 46 , 47 , 48 ]. Most variations in the SPAD’s response are thus masked by the digital conversion performed by the quenching circuit which therefore provides a greater SPAD-to-SPAD variation immunity.…”

Section: Analog Versus Digital Spad Arraymentioning

confidence: 99%

“…In this scheme, a high fill-factor front side illuminated SPAD array is implemented on the first tier (dedicated SPAD process). The underneath electronics (second tier) is implemented in a chosen CMOS process according to the levels of complexity and functionality needed by the application [ 46 , 48 , 69 , 70 , 71 , 72 ].…”

Section: 2d Versus 3d Integrated Pdcmentioning

confidence: 99%

“…The selection of the CMOS process should take into account the SPAD characteristics, such as the bias excess voltage the front-end electronics will need to quench, the size of the SPAD wafers to match with the CMOS wafers for 3D integration, the SPAD size constraining the size of front-end electronics for each SPAD, the complexity of the desired digital signal processing embedded in the ASIC, the cost and the availability of MPW runs. For instance, in the specific case of ToF-PET imaging, a TDC with sub-10 ps FWHM is desirable and points toward more advanced CMOS processes [ 48 , 129 , 132 , 133 ]. In the case of noble liquid detectors, very large area must be covered with maximum fill-factor and minimal power consumption to prevent boiling and convection of the noble liquid [ 12 , 66 ].…”

Section: Perspective Of 3d Pdc For Radiation Instrumentationmentioning

confidence: 99%

“…Considering this, in a 3D PDC optimized for large area detectors where the power consumption is a critical requirement, an inverter is preferred. On the other hand, for an SPTR optimized 3D PDC for PET, a comparator should be implemented [ 48 ].…”

Section: Perspective Of 3d Pdc For Radiation Instrumentationmentioning

confidence: 99%

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3D Photon-To-Digital Converter for Radiation Instrumentation: Motivation and Future Works

Pratte

Nolet

Parent

et al. 2021

Sensors

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Analog and digital SiPMs have revolutionized the field of radiation instrumentation by replacing both avalanche photodiodes and photomultiplier tubes in many applications. However, multiple applications require greater performance than the current SiPMs are capable of, for example timing resolution for time-of-flight positron emission tomography and time-of-flight computed tomography, and mitigation of the large output capacitance of SiPM array for large-scale time projection chambers for liquid argon and liquid xenon experiments. In this contribution, the case will be made that 3D photon-to-digital converters, also known as 3D digital SiPMs, have a potentially superior performance over analog and 2D digital SiPMs. A review of 3D photon-to-digital converters is presented along with various applications where they can make a difference, such as time-of-flight medical imaging systems and low-background experiments in noble liquids. Finally, a review of the key design choices that must be made to obtain an optimized 3D photon-to-digital converter for radiation instrumentation, more specifically the single-photon avalanche diode array, the CMOS technology, the quenching circuit, the time-to-digital converter, the digital signal processing and the system level integration, are discussed in detail.

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Section: Analog Versus Digital Spad Arraymentioning

confidence: 99%

Section: 2d Versus 3d Integrated Pdcmentioning

confidence: 99%

Section: Perspective Of 3d Pdc For Radiation Instrumentationmentioning

confidence: 99%

Section: Perspective Of 3d Pdc For Radiation Instrumentationmentioning

confidence: 99%

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3D Photon-To-Digital Converter for Radiation Instrumentation: Motivation and Future Works

Pratte

Nolet

Parent

et al. 2021

Sensors

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“…The 5.5 ps RMS timing jitter was measured at a 5.1 ps LSB over a 4 ns dynamic range. The jitter was measured using the methods described in [3,4]. The performance of the proposed Vernier TDC is summarised in Table 1 with previously reported high-resolution TDCs.…”

mentioning

confidence: 99%

22 μW, 5.1 ps LSB, 5.5 ps RMS jitter Vernier time‐to‐digital converter in CMOS 65 nm for single photon avalanche diode array

et al. 2020

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A Vernier ring-oscillator-based time-to-digital converter (TDC) with a new prelogic is presented. Experimental results show that the proposed architecture achieve a 5.5 ps RMS timing jitter with a 5.1 ps LSB within an area of 0.00151 mm 2. Thanks to the new prelogic circuit, the power consumption of the circuit was optimised to 22 mW at a rate of 1 Mevents/s for a dynamic range of 4 ns. The area, timing jitter and power consumption make the TDC suitable for an array of electronic readout in a position emission tomography single photon avalanche diode based detectors.

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Achieving 10 ps coincidence time resolution in TOF‐PET is an impossible dream

Schaart

Ziegler

Zaidi³

2020

Medical Physics

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A 256 Pixelated SPAD readout ASIC with in-Pixel TDC and embedded digital signal processing for uniformity and skew correction

Cited by 22 publications

References 36 publications

3D Photon-To-Digital Converter for Radiation Instrumentation: Motivation and Future Works

3D Photon-To-Digital Converter for Radiation Instrumentation: Motivation and Future Works

22 μW, 5.1 ps LSB, 5.5 ps RMS jitter Vernier time‐to‐digital converter in CMOS 65 nm for single photon avalanche diode array

Achieving 10 ps coincidence time resolution in TOF‐PET is an impossible dream

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