1985 International Electron Devices Meeting 1985
DOI: 10.1109/iedm.1985.191049
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A 256K high performance CMOS EEPROM technology

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Cited by 6 publications
(2 citation statements)
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“…Though progress has been slow, EEPROM products are making steady headway [37][38][39][40][41][42], and are being applied to microcomputers as on-chip electrically alternative nonvolatile memories. Lai et al [43] reviewed the three dominant EEPROM technologies, as shown in Fig.…”
Section: Flash Memory Design Considerationsmentioning
confidence: 99%
“…Though progress has been slow, EEPROM products are making steady headway [37][38][39][40][41][42], and are being applied to microcomputers as on-chip electrically alternative nonvolatile memories. Lai et al [43] reviewed the three dominant EEPROM technologies, as shown in Fig.…”
Section: Flash Memory Design Considerationsmentioning
confidence: 99%
“…Chang, Ching-Feng et al researched the influence of the air-gap change due to the thermal expansion of the rotor on the vibration performance of the motorized spindle [4]. Chen, Jenq-Shyong studied Many nonlinear and time-varying thermal sources, such as coolant jacket, motor air-gap, motion joints and assembly interfaces influence thermal displacement [5]. Liang jinghui et al studied the air-gap changes influence on the power factor, harmonic magnetic field, torque ripple and additional loss [6].…”
Section: Introductionmentioning
confidence: 99%