A 3D wideband package solution using MCM-D BCB technology for tile TR module

Barbier, T.; Mazel, F.; Reig, B.; Monfraix, P.

doi:10.1109/eumc.2005.1610234

Cited by 8 publications

(3 citation statements)

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“…An LTCC interposer was used as a fixture for fuzz button interconnects. There have been several studies corroborating the benefits of using fuzz button interconnects for RF applications [70][71][72][73]. Figure 14a shows a schematic of the cross section of the fuzz button press pack module.…”

Section: Present Wire Bondless Integration Efforts In Power Electronicsmentioning

confidence: 99%

High Performance Silicon Carbide Power Packaging—Past Trends, Present Practices, and Future Directions

Seal

Mantooth

2017

Energies

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This paper presents a vision for the future of 3D packaging and integration of silicon carbide (SiC) power modules. Several major achievements and novel architectures in SiC modules from the past and present have been highlighted. Having considered these advancements, the major technology barriers preventing SiC power devices from performing to their fullest ability were identified. 3D wire bondless approaches adopted for enhancing the performance of silicon power modules were surveyed, and their merits were assessed to serve as a vision for the future of SiC power packaging. Current efforts pursuing 3D wire bondless SiC power modules were described, and the concept for a novel SiC power module was discussed.

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Section: Present Wire Bondless Integration Efforts In Power Electronicsmentioning

confidence: 99%

High Performance Silicon Carbide Power Packaging—Past Trends, Present Practices, and Future Directions

Seal

Mantooth

2017

Energies

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“…The frequency range for the fuzz button connector is from DC to 40 GHz and it has been widely employed in TR modules. 4,5 For example, Barbie et al used solderless 1 mm diameter fuzz buttons developed by TECKNIT to realize vertical radiofrequency (RF) interconnections between the RF levels, which are enclosed into metallic rings to ensure ground continuity. Fuzz buttons are also used in the design of a frequency synthesizer and SiC MOSFET packaging.…”

Section: Introductionmentioning

confidence: 99%

“…At present, the research on fuzz buttons is mostly about their applications. The frequency range for the fuzz button connector is from DC to 40 GHz and it has been widely employed in TR modules 4,5 . For example, Barbie et al used solderless 1 mm diameter fuzz buttons developed by TECKNIT to realize vertical radiofrequency (RF) interconnections between the RF levels, which are enclosed into metallic rings to ensure ground continuity.…”

Section: Introductionmentioning

confidence: 99%

Investigation of signal integrity of fuzz button connectors under different compression states

Wang

Gao

Flowers

et al. 2023

Micro & Optical Tech Letters

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Fuzz button connectors are extensively used in vertical interconnection for high‐density integrated circuits. This work studied the impact of fuzz buttons under different compression states on high‐frequency signal transmission using theoretical analysis and experimental testing. The resistance values for fuzz buttons with different heights in compression states were measured. The physical dimensions were obtained for sample fuzz buttons subjected to various compression states. The effects of long‐term compression of fuzz button on the resistance values and S parameters of the device under test (DUT) were analyzed. In addition, the high‐frequency parameters were measured for the DUT with fuzz buttons in various compression states. Both a three‐dimensional (3D) electromagnetic field model and an equivalent circuit model for the fuzz buttons under compression states were developed and the results of these two models show good agreement with experimental results. In the circuit model, a fuzz button connector with a three‐wire transmission line structure was modeled as a π impedance network, composed of equivalent inductances and capacitances. It was found that the proposed 3D electromagnetic field model and an equivalent circuit model can accurately predict the effect of fuzz buttons under different compression states on the signal transmission in the affected frequency band. However, the models cannot evaluate the communication performance of the whole system.

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