IEEE MTT-S International Microwave Symposium Digest, 2003
DOI: 10.1109/mwsym.2003.1210415
|View full text |Cite
|
Sign up to set email alerts
|

A 4-bit miniature X-band MEMS phase shifter using switched-LC networks

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1

Citation Types

0
9
0

Publication Types

Select...
6
3
1

Relationship

0
10

Authors

Journals

citations
Cited by 14 publications
(9 citation statements)
references
References 10 publications
0
9
0
Order By: Relevance
“…have been demonstrated in the past few years [1]- [4]. All of the reported results have been for unpackaged devices.…”
Section: Introduction High Performance Rfmems Time Delays and Phasmentioning
confidence: 91%
“…have been demonstrated in the past few years [1]- [4]. All of the reported results have been for unpackaged devices.…”
Section: Introduction High Performance Rfmems Time Delays and Phasmentioning
confidence: 91%
“…However, compared with passive TTD circuits, these active solutions consume a certain power meanwhile exhibiting a limited linearity performance. Switch-based solutions such as a switched-TL and a switched LC-network provide an alternative way to achieve low insertion loss and a large delay tuning range while keeping Z0 constant when configuring TTD [9], [10]. Copyright c 2019 The Institute of Electronics, Information and Communication Engineers illustrates a switched line structure typically used in TTD lines.…”
Section: Design Considerationsmentioning
confidence: 99%
“…From an implementation point of view, monolithic integration of RF-MEMS switch with other RF circuits is preferred to lower the cost and to improve the fabrication yield. Conventional MEMS monolithic phase shifters were composed mainly by the surface-micromachining on a compound semiconductor substrate such as GaAs [5], resulting in limited degrees of freedom in 3-dimentional structures and high material cost. Thanks to the recent process innovations [6,7], bulk-micromachining and gold-electroplating processes have been combined to integrate RF passive elements with MEMS micro actuators in a single silicon chip.…”
Section: Introductionmentioning
confidence: 99%