A 700-$\mu$W Wireless Sensor Node SoC for Continuous Real-Time Health Monitoring

Teo, T. Hui; Qian, Xinbo; Gopalakrishnan, P. K.; Hwan, Yui; Kuruveettil, Haridas; Pang, Chin Yann; Cha, Hyouk-Kyu; Je, Minkyu

doi:10.1109/jssc.2010.2064030

Cited by 22 publications

(11 citation statements)

References 18 publications

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“…To illustrate the advantage of our proposed circuitry, we present a design example of a 433-MHz Class-E PA for on-chip integration with 3 dBm output power. Normally the low-power PAs at such low frequency range require inductance values larger than 40 nH, making it impractical to be implemented on-chip due to huge area penalty and poorer quality factor [27], [28]. Our proposed circuitry can potentially overcome such issues and provide full chip solution even for such a low operating frequency.…”

Section: Analysis and Design Of Fully Integrated Class-e Pamentioning

confidence: 99%

Design of Efficient Class-E Power Amplifiers for Short-Distance Communications

Tan

Heng

Lian

2012

IEEE Trans. Circuits Syst. I

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This paper presents a new Class-E power amplifier (PA) with a -matching output network. The PA is targeted at low output power wireless applications. Analytical formulae are derived to aid the PA design, characterization and optimization. A fully integrated 2.4-GHz PA for short distance communications has been implemented in 0.13 m CMOS technology to verify the proposed design method. The measured output power levels vary from 3.2 to 5.7 dBm while achieving maximum overall efficiency of 55%.

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Section: Analysis and Design Of Fully Integrated Class-e Pamentioning

confidence: 99%

Design of Efficient Class-E Power Amplifiers for Short-Distance Communications

Tan

Heng

Lian

2012

IEEE Trans. Circuits Syst. I

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“…Similar to [3] a fourth order Cascade Integrator-Comb (CIC) assumed to be assumed the same as the so called 'comb' filter followed by two 22 nd order half-band filters was proposed. Studies in [1] and [5] both have presented a 3 stage decimation filter containing a CIC, and two half-band FIR filters, where [5] implemented its coefficients in CSD in order to reduce the hardware complexity. In addition to these, [6] presented a 4 stage decimator containing a 'comb filter', followed by a compensator and two FIR filters.…”

Section: Introductionmentioning

confidence: 99%

Low complexity all-pass based polyphase decimation filters for ECG monitoring

Eminaga¹,

Coskun²,

Moschos

et al. 2015

2015 11th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME)

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“…High quality factor (Q-factor) radiofrequency (RF) performance of the resonator has implicated the glass interposer can be a good hosting medium for high quality RF circuits, i.e. bandpass filters (BPF), supporting modern devices required for system on package (SoP) and system on chip (SoC) technologies [5,6].…”

Section: Introductionmentioning

confidence: 99%

Through-glass interposer integrated high quality RF components

Kim

Senior

Shorey

et al. 2014

2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

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High quality and compact RF devices, using the half mode substrate integrated waveguide (HMSIW) architecture loaded with a complementary split ring resonator (CSRR), are implemented on a glass interposer layer, which therefore serves as an interconnection layer and as a host medium for integrated passive RF components. Compared with the silicon interposer approach, which suffers from large electrical conductivity and therefore substrate loss, the glass interposer has advantages of low substrate loss, allowing high quality interconnection and passive circuits, and low material and manufacturing costs. Corning fusion glass is selected as the substrate to realize the compact CSRR-loaded HMSIW resonators and bandpass filters (BPFs) working under the principle of evanescent wave amplification. Two and three pole bandpass filters are designed for broadband operation at 5.8 GHz. Thru glass vias (TGVs) are used to define the side-wall of the substrate integrated waveguiding structure. Surface micromachining techniques are used to fabricate the proposed devices. The variations of the external quality factor (Qe) of the resonator and the internal coupling coefficient (M) of the coupled resonators are studied for filter design. Operation of the filters at 5.8 GHz with a fractional bandwidth (FBW) of more than 10% for an in-band return loss of better than 20 dB and an low insertion loss of less than 1.35 dB has been obtained, which is not feasible with a usual Si interposer approach. Measurement results are presented from 2 to 10 GHz and show good agreement with simulated ones. IntroductionThe through-glass interposer (TGI) technology rapidly grows up as a promising alternative to the through-silicon interposer (TSI) because of its low substrate loss in the RF/microwave range, the mechanical robustness and low material and manufacturing cost [1][2][3]. Also, recent advancement on the corning fusion process for pristine surface glass substrates and through glass via (TGV) processes including wet and dry etching, laser drilling, and W-plug [1], have made the glass interposer much viable in the market. Previously, we have reported the high frequency characterization of Corning glass using a ring resonator, as well as the modeling of high frequency TGV using Corning glasses [4]. High quality factor (Q-factor) radiofrequency (RF) performance of the resonator has implicated the glass interposer can be a good hosting medium for high quality RF circuits, i.e. bandpass filters (BPF), supporting modern devices required for system on package (SoP) and system on chip (SoC) technologies [5,6].It is known that during the years BPFs for wireless systems have used the waveguide, microstrip and coplanar waveguide

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A 700-$\mu$W Wireless Sensor Node SoC for Continuous Real-Time Health Monitoring

Cited by 22 publications

References 18 publications

Design of Efficient Class-E Power Amplifiers for Short-Distance Communications

Design of Efficient Class-E Power Amplifiers for Short-Distance Communications

Low complexity all-pass based polyphase decimation filters for ECG monitoring

Through-glass interposer integrated high quality RF components

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