2012 IEEE Radio Frequency Integrated Circuits Symposium 2012
DOI: 10.1109/rfic.2012.6242334
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A 77GHz automotive radar receiver in a wafer level package

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Cited by 30 publications
(15 citation statements)
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“…As final result a three channel 77 GHz transmitter and a four channel receiver have been qualified as first packaged radar products in 2012 [6,7]. Fig.…”
Section: Embedded Wafer Level Ball Grid Array (Ewlb) Packaging Tmentioning
confidence: 94%
“…As final result a three channel 77 GHz transmitter and a four channel receiver have been qualified as first packaged radar products in 2012 [6,7]. Fig.…”
Section: Embedded Wafer Level Ball Grid Array (Ewlb) Packaging Tmentioning
confidence: 94%
“…The radar functionality is integrated in SiGe MMICs from Infineon Technologies [10]. The frontend MMIC contains the TRX units, sensors for power and temperature monitoring and a digital control logic.…”
Section: I S Y S T E M C O N C E P Tmentioning
confidence: 99%
“…Industrial research strongly focused on bringing the costs of the technology down in recent years, see e.g. rfpackages in [24] and SiGe-technology for automotive MMICs [25,26]. Concerning the MMIC CMOS and SiGe (BiCMOS) are candidates for future automotive radars, even in the frequency range at 158 GHz, see e.g.…”
Section: Doppler Signaturesmentioning
confidence: 99%
“…On the other hand there are some hints that there might be limits on CMOS for automotive MMIC as shown in [31]. Concerning packaging, many different approaches are under investigation or are already in use [25,26], again even up to 170 GHz, see [32].…”
Section: Doppler Signaturesmentioning
confidence: 99%