2012 IEEE International Solid-State Circuits Conference 2012
DOI: 10.1109/isscc.2012.6176976
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A &#x00B1;0.4&#x00B0;C (3&#x03C3;) &#x2212;70 to 200&#x00B0;C time-domain temperature sensor based on heat diffusion in Si and SiO<inf>2</inf>

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Cited by 7 publications
(3 citation statements)
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“…The PDΣ∆M is incorporated into a two-step (zoom) ADC architecture to increase its speed and minimize its inherent (cosine) non-linearity [10]. As shown in Fig.…”
Section: Circuit Descriptionmentioning
confidence: 99%
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“…The PDΣ∆M is incorporated into a two-step (zoom) ADC architecture to increase its speed and minimize its inherent (cosine) non-linearity [10]. As shown in Fig.…”
Section: Circuit Descriptionmentioning
confidence: 99%
“…During the coarse conversion, Φ0 and Φ1 are set to cover the full temperature range, and a 64-step conversion is used to make a 4-bit estimate of the ETF's phase (Φcoarse). In contrast to [10], which used a SAR ADC in the coarse conversion, a Σ∆M is used here because of the its robustness to thermal noise and its compatibility with chopping and HDI. During the fine conversion, Φ0 and Φ1 are set to straddle Φcoarse, such that Φ1 -Φ0 = 11.25°.…”
Section: Circuit Descriptionmentioning
confidence: 99%
“…Thermal diffusivity (TD) sensors [8], and resistor-based sensors [9] have also demonstrated good accuracy at high temperatures. Compared to BJT-based sensors, however, the milliwatt-level power dissipation of TD sensors, and the 2point calibration required by precision resistor-based TDCs makes them less suitable for automotive applications.…”
Section: Introductionmentioning
confidence: 99%