Proposed is a new selective negative word line scheme that yields almost 2.7% of the fail bit count (FBC) in a DRAM chip with a conventional negative word line scheme in the pause refresh state. It has a superior dynamic refresh characteristic, which is almost 0.3% of the FBC in a DRAM chip using the ground word line scheme. This scheme leads to a very low cell V TH (threshold voltage).Introduction: In the DRAM industry, the negative word line (NWL) scheme [1] is presently one of the most representative techniques used for low voltage operation [2][3][4]. However, it also has disadvantages, such as gate-induced drain leakage (GIDL) [5]. We propose a new NWL approach called the 'selective negative word line scheme' (SNWL) [6], which has the advantages of both the conventional NWL and the ground word line (GWL) scheme, even though it has an area penalty of 0.01% for the switching circuits, compared with the NWL scheme.