A boundary technique for calculation of distributed resistance

Chawla, B.R.; Gummel, H.K.

doi:10.1109/t-ed.1970.17095

Cited by 39 publications

(5 citation statements)

References 8 publications

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“…For this stage, the discharge model and the fluid dynamic model were fully coupled. The plasma discharge model (equations ( 1)-( 4)) calculates the averaged statistical properties of the plasma particles by solving the continuity (equation ( 1)) and drift-diffusion equations (equation ( 2)) using the Scharfetter-Gummel method [33] for flux calculation with an adaptive time step. The Poisson equation (equation ( 3)) for electric field was solved using the LU triangular matrix decomposition [27].…”

Section: Governing Equations and Numerical Methodsmentioning

confidence: 99%

Investigation of nanosecond-pulsed dielectric barrier discharge actuators with powered electrodes of different exposures

Cai

Lian

2017

Plasma Sci. Technol.

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Nanosecond-pulsed dielectric barrier discharge actuators with powered electrodes of different exposures were investigated numerically by using a newly proposed plasma kinetic model. The governing equations include the coupled continuity plasma discharge equation, drift-diffusion equation, electron energy equation, Poisson's equation, and the Navier-Stokes equations. Powered electrodes of three different exposures were simulated to understand the effect of surface exposure on plasma discharge and surrounding flow field. Our study showed that the fully exposed powered electrode resulted in earlier reduced electric field breakdown and more intensive discharge characteristics than partially exposed and rounded-exposed ones. Our study also showed that the reduced electric field and heat release concentrated near the right upper tip of the powered electrode. The fully exposed electrode also led to stronger shock wave, higher heating temperature, and larger heated area.

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Section: Governing Equations and Numerical Methodsmentioning

confidence: 99%

Investigation of nanosecond-pulsed dielectric barrier discharge actuators with powered electrodes of different exposures

Cai

Lian

2017

Plasma Sci. Technol.

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“…An efficient experiment plan in those dimensions is then formed. The two-dimensional Laplace equation solver RESCAL [15] is used to calculate the capacitance of a single conductor, a pair of conductors, and three conductors over the field oxide region.…”

Section: Tcad Automated Interconnect Modelingmentioning

confidence: 99%

Technology CAD for competitive products

Lloyd

Dirks

Prendergast

et al. 1990

IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

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Recent trends in the integration of process, device and circuit modeling tools and the current rapid emergence of UNIX® based computing environments of networked workstations and compute engines makes possible user-friendly, taskbased CAD systems for technology optimization, characterization and cell design. The paper discusses these trends and identifies opportunities to leverage Technology CAD tools in the development of competitive technologies and products. i I:This paper describes how tools for technology CAD, in use at AT&T Bell Laboratories, arc integrated into a task-based system designed to meet the needs of IC technology development and circuit design for optimization, characterization, and verification. TCAD is the name given to this system and it is made up of state-of-the-art, user-friendly modeling tools. These tools include those for process, device and circuit simulation, parameter extraction and optimization.The TCAD environment is UNIX. The highest level of TCAD is a user interface program, tcad, written in C and shell, tcad is easily ported across UNIX systems so the investment in development is protected and efforts are not duplicated. It monitors access and usage patterns, tracks tasks routinely performed, has electronic communication facilities between users and program developers and provides various levels of restricted-access for certain sensitive or beta-stage tools and technology files. Provision is made to capture input files to add to the regression data-base, or when tools terminate abnormally. TCAD tools can be used independently or coupled together to form tasks.The TCAD system is open to the integration of a variety of tools including exploratory products and the primary TCAD tools are accurate, flexible, robust and user-friendly. Some of these primary tools are described in the next section. The philosophy behind the TCAD architecture is outlined in the third section. Much of the power of TCAD comes from UNIX through networking and distributed computing. These features of UNIX and their impact on TCAD arc described in Section 4. Several examples of TCAD tasks and concluding remarks are given in the fifth and sixth sections, respectively. The Building Blocks for TCADTCAD leverages current predictive tools for process to cell level design. Some of these tools are described below including the process simulator BICEPS-5.0, the device simulator MEDUSA, the statistical process/device simulator FABRICS, the parameter extractor ARTHUR, the circuit simulator ADVICE and the optimizer CENTER. The Process Simulator BICEPS-5.0BICEPS-5.0 is a modular two-dimensional process simulator that retains the coordinate transformation philosophy of the original code [4]. It contains models for ion implantation, predeposition, drive-in in inert and oxidizing ambients, epitaxy, etching and deposition. The diffusion equation is solved using finite differences. Improvements over the original code include new physical models, an improved user interface, a new graphic package and new numerical methods.The i...

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“…They are the key properties of the RCutSim trim simulator developed by the paper's authors. We also should mention a number of in-depth studies that resulted in the development of trim resistance estimation software or a full-fledged mathematical model [29][30][31][32].…”

Section: Introductionmentioning

confidence: 99%

Software Engineering of Resistive Elements Electrophysical Parameters Simulation in the Process of Laser Trimming

Кондрашов

Seredin

Chapkin³

et al. 2023

Electronics

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This study continues a series of papers covering the R&D of circuit simulators embedded into manufacturing equipment for the laser trimming of film and foil resistors intended to improve the final product’s performance and reduce process costs. Our paper describes the development of the ResModel laser trimming simulation software. Various types of trims and their features are presented for a circuit with a dynamic measurement DC source, and the optimal trim configurations are identified. The software can be used to estimate and display resistive element properties during the trimming such as its electrophysical parameters and their trends.

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A boundary technique for calculation of distributed resistance

Cited by 39 publications

References 8 publications

Investigation of nanosecond-pulsed dielectric barrier discharge actuators with powered electrodes of different exposures

Investigation of nanosecond-pulsed dielectric barrier discharge actuators with powered electrodes of different exposures

Technology CAD for competitive products

Software Engineering of Resistive Elements Electrophysical Parameters Simulation in the Process of Laser Trimming

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