A brief review of amorphous semiconductors

Saraswat, Shobhit; Tomar, V. K.; Deolia, Vinay Kumar; Mehta, N.

doi:10.1016/j.matpr.2023.03.455

Cited by 2 publications

(1 citation statement)

References 17 publications

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“…Semiconductors are essential to the operation of all electronic equipment, from home computers to unmanned car circuits. The most widely used conductors are based on silicon and gallium arsenide, which have optical properties [1,2]. They are used in the production of solar panels and LEDs.…”

Section: Introductionmentioning

confidence: 99%

Adhesion Strength of Al, Cr, In, Mo, and W Metal Coatings Deposited on a Silicon–Carbon Film

et al. 2023

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For the first time, the possibility of creating a multilayer system metal (Al, Cr, In, Mo, and W) silicon–carbon coating was studied. A silicon–carbon film was synthesized from a polyorganosiloxane polymer containing an active Si–O siloxane group. Due to the use of furnace pyrolysis, in which the purge gas continuously removes the polymer thermal degradation products from the system, it was possible to reduce the film formation temperature to 300 °C. According to the energy dispersive analysis data, silicon–carbon film has the following composition: C—34.85 wt%, O—42.02 wt%, and Si—23.13 wt%. Metallic coatings of Al, Cr, In, Mo, and W on a silicon–carbon substrate were obtained by vacuum magnetron sputtering. The metallic coatings were evaluated by SEM as well as by X-ray phase analysis. The adhesion strength of metallic coatings to the silicon–carbon substrate was assessed by scratching under continuously increasing load with a Rockwell C Diamond Indenter. At the same time, the friction coefficient was recorded at the corresponding value of load on the indenter. The adhesive strength of metals with the silicon–carbon substrate increases in the sequence W, Mo, In, Al, and Cr.

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Section: Introductionmentioning

confidence: 99%

Adhesion Strength of Al, Cr, In, Mo, and W Metal Coatings Deposited on a Silicon–Carbon Film

et al. 2023

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Construction of Vine-Inspired Antimicrobial Filter with Multiscale 3D Nanonetwork for High-Efficiency Air Filtration

Xiong,

Cai,

et al. 2024

ACS Appl. Mater. Interfaces

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Enhancing the antimicrobial activity of highefficiency particulate air (HEPA) filters while maintaining filtration efficiency and pressure drop is currently an urgent issue for preventing the spread of pathogenic microorganisms. Herein, inspired by vines which can enwind fences to fix as well as decorate them, a flexible antimicrobial chitin nanofiber (ChNF@CuO x ) was fabricated and loaded onto the rigid glass fiber (GF) skeleton of a HEPA filter. Through the physical interaction, ChNF@CuO x was spontaneously enwound on GF, and ChNF@CuO x itself interweaved to form a new nanonetwork between the GF skeleton. The obtained antimicrobial air filter (ChNF@CuO x /GF) with a unique nanonetwork increased the filtration efficiency of the HEPA filter. Meanwhile, it possessed excellent inactivation ability against Staphylococcus aureus, Escherichia coli, and Candida albicans due to the urchin-like in situ grown CuO x on the ChNF. In particular, the oxygen vacancies generated unexpectedly in CuO x enabled it to produce reactive oxygen species. After eight cycles of antimicrobial assays, the antimicrobial rates of bacteria were higher than 99.5%, and those of fungi were greater than 98.3%. The successful synthesis of antimicrobial fibers and the construction of multidimensional nanoscale structures through a simple postprocessing method provide a new design mentality for antimicrobial functionalization for HEPA filters.

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A brief review of amorphous semiconductors

Cited by 2 publications

References 17 publications

Adhesion Strength of Al, Cr, In, Mo, and W Metal Coatings Deposited on a Silicon–Carbon Film

Adhesion Strength of Al, Cr, In, Mo, and W Metal Coatings Deposited on a Silicon–Carbon Film

Construction of Vine-Inspired Antimicrobial Filter with Multiscale 3D Nanonetwork for High-Efficiency Air Filtration

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