A clinical study of failure in microchannel cooled diodes used in large laser systems

Jäckel, S.; Meir, Avi; Horvitz, Zvi; Moshe, Inon; Shimoni, Yehoshua; Lumer, Yaakov; Feldman, Revital; Hershko, Izhak; Pekin, Yotam

doi:10.1016/j.optlastec.2010.09.011

Cited by 2 publications

(3 citation statements)

References 7 publications

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“…Therefore the surface tension of the liquid and the wetting characteristics of the microchannel wall material need to be adjusted such that microchannel filling, driven by capillary forces, takes place. 83 Filtered tap water, deionized water Copper 500-1000 Balsley (2009) 84 Deionized water Copper, surfaces were Au plated 1000-5000 Jackel (2011) 85 150-300 Filtered, deionized, deoxygenated water; 10% acetic acid Copper with Au coating Makarshin (2011) 91 50 Catalytic partial oxidation of methane FeCrAl Eichhorn and Gietzelt (2012) 76 Hot sulfuric acid (95-97% at 100 1C/50% at 125 1C)…”

Section: Corrosion Foulingmentioning

confidence: 99%

“…This might result in fouling layers or complete blockages of the microstructures or the equipment downstream. So far, no reports covering corrosion fouling in microstructured devices have been published, whereas papers covering the preliminary phenomena erosion [77][78][79][80][81][82] and/or corrosion [83][84][85][86][87][88][89][90][91] of microchannels exist. To give an overview of the investigations of these preliminary phenomena of corrosion fouling, Table 5 lists experimental reports of erosion and corrosion in microstructured devices stating the fluid or substance used, the surface material of the microchannel walls and the maximum duration of the experiments.…”

Section: Corrosion Foulingmentioning

confidence: 99%

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Fouling in microstructured devices: a review

et al. 2015

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Microstructured devices are widely used for manufacturing products that benefit from process intensification, with pharmaceutical products or specialties of the chemical industry being prime examples. These devices are ideally used for processing pure fluids. Where particulate or non-pure flows are involved, processes are treated with utmost caution since related fouling and blocking issues present the greatest barrier to operating microstructured devices effectively. Micro process engineering is a relatively new research field and there is limited understanding of fouling in these dimensions and its underlying processes and phenomena. A comprehensive review on fouling in microstructured devices would be helpful in this regard, but is currently lacking. This paper attempts to review recent developments of fouling in micro dimensions for all fouling categories (crystallization, particulate, chemical reaction, corrosion and biological growth fouling) and the sequential events involved (initiation, transport, attachment, removal and aging). Compared to fouling in macro dimensions, an additional sixth category is suggested: clogging by gas bubbles. Most of the reviewed papers present very specific fouling investigations making it difficult to derive general rules and parameter dependencies, and comparative or critical considerations of the studies were difficult. We therefore used a statistical approach to evaluate the research in the field of fouling in microchannels.

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Section: Corrosion Foulingmentioning

confidence: 99%

Section: Corrosion Foulingmentioning

confidence: 99%

Fouling in microstructured devices: a review

et al. 2015

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“…However, the peak value of the PCE as well as the decrease in PCE, as the operating current is further increased, are related to the rise in the LD temperature from Joule heating. The LD temperature is also a function of the thermal impedance which depends on the LD-structure, the die-attach and the heat-sink.Although copper-based, water-cooled, micro-channel coolers (Cu-MCCs) have the lowest values of thermal impedance, their use is generally avoided since reliable operation requires the use of de-ionized (DI) water whose resistivity, oxygen content, and pH must be actively controlled to minimize corrosion and electro-corrosion of the copper [2][3][4][5][6][7]. Further, DI-water as a coolant is unsuitable for systems that must meet the storage requirements of Mil-Std 810G, e.g.…”

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confidence: 99%

Copper-based micro-channel cooler reliably operated using solutions of distilled-water and ethanol as a coolant

Chin¹,

Nelson

Chin

et al. 2015

SPIE Proceedings

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Copper-based micro-channel coolers (Cu-MCC) are the lowest thermal-resistance heat-sinks for high-power laserdiode (LD) bars. Presently, the resistivity, pH and oxygen content of the de-ionized water coolant, must be actively controlled to minimize cooler failure by corrosion and electro-corrosion. Additionally, the water must be constantly exposed to ultraviolet radiation to limit the growth of micro-organisms that may clog the micro-channels. In this study, we report the reliable, care-free operation of LD-bars attached to Cu-MCCs, using a solution of distilledwater and ethanol as the coolant. This coolant meets the storage requirements of Mil-Std 810G, e.g. exposure to a storage temperature as low as -51°C and no growth of micro-organisms during passive storage. BackgroundDue in significant part to DARPA's super-high-efficiency diode-sources (SHEDS) program [1], the peak value of the power-conversion efficiency (PCE) of commercial, 9xx-nm laser-diodes (LDs) are in the range of 65%-75%. However, the peak value of the PCE as well as the decrease in PCE, as the operating current is further increased, are related to the rise in the LD temperature from Joule heating. The LD temperature is also a function of the thermal impedance which depends on the LD-structure, the die-attach and the heat-sink.Although copper-based, water-cooled, micro-channel coolers (Cu-MCCs) have the lowest values of thermal impedance, their use is generally avoided since reliable operation requires the use of de-ionized (DI) water whose resistivity, oxygen content, and pH must be actively controlled to minimize corrosion and electro-corrosion of the copper [2][3][4][5][6][7]. Further, DI-water as a coolant is unsuitable for systems that must meet the storage requirements of Mil-Std 810G, e.g. -51°C ambient storage temperature and no growth of biologicals during passive storage.According to Stickley et al. [1], PCE is the single most-important specification for high-energy lasers (HELs) since it ultimately determines the size of the power supply and refrigeration system. To ensure that LD-pumped HELs have the highest efficiency, the use of MCCs is unavoidable. As a result, we have modified the coolant and electrical configuration to simplify and ensure the reliable operation of Cu-MCCs. Operation of Cu-MCCs using a solution of distilled water and ethanol minimizes corrosion and electro-corrosion while simultaneously meeting the storage requirements of Mil-Std 810G.High-Power Diode Laser Technology and Applications XIII, edited by Mark S. Zediker, Proc. of SPIE Vol. 9348, 93480Y · © 2015 SPIE · CCC code: 0277-786X/15/$18

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A clinical study of failure in microchannel cooled diodes used in large laser systems

Cited by 2 publications

References 7 publications

Fouling in microstructured devices: a review

Fouling in microstructured devices: a review

Copper-based micro-channel cooler reliably operated using solutions of distilled-water and ethanol as a coolant

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