A CMOS Bidirectional 32-Element Phased-Array Transceiver at 60 GHz With LTCC Antenna

Cohen, E.; Ruberto, Mark N.; Cohen, Moshe-Ishay; Degani, Ofir; Ravid, Shmuel; Ritter, D.

doi:10.1109/tmtt.2013.2243749

Cited by 136 publications

(32 citation statements)

References 21 publications

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“…In addition to the cost, the co-firing process does not yield high tolerance for the package stackup, which means most test structures such as antennas have to be overdesigned to compensate for potential process variations. In [6], an alumina substrate was used, but that substrate only had one level of interconnect that enabled flip-chip die assembly without on-package antenna integration. Several organic substrate materials have been investigated including liquid crystal polymers (LCP) [7] and BT laminate [8], [9].…”

Section: Introductionmentioning

confidence: 99%

Investigation of a photodefinable glass substrate for millimeter-wave radios on package

Kamgaing

Elsherbini

Frank

et al. 2014

2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

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Photodefinable glass has been investigated for applications at mm-wave frequencies. Test structures including throughglass vias, transmission lines and microstrip patch antennas have been fabricated and fully characterized up to 67 GHz. Good correlation was obtained between simulation and measurements. The antenna exhibited return loss better than 10 dB in the frequency band of interest. Via transition losses were less than 0.15 dB/via and the transmission line insertion loss was ~ 3.3 dB/cm at 60 GHz.

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Section: Introductionmentioning

confidence: 99%

Investigation of a photodefinable glass substrate for millimeter-wave radios on package

Kamgaing

Elsherbini

Frank

et al. 2014

2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

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“…The work also shows that complex millimeter-wave phased-array chips can be packaged using traditional bond-wire techniques, and thus are suitable for low-cost high-volume applications. This is in contrast to the traditional assumption that complex phased-array chips must be packaged using flip-chip techniques to achieve acceptance performance at millimeter-wave frequencies [16], [17]. This paper concludes with a demonstration of an advanced frequency-modulated continuous-wave (FMCW) automotive radar based on the 16-element phased-array receiver together with a fixed transmitter, and the resulting millimeter-wave high-resolution radar data taken on cars and pedestrians at 76.5-77 GHz is presented.…”

Section: Introductionmentioning

confidence: 89%

A 77–81-GHz 16-Element Phased-Array Receiver With $\pm {\hbox{50}}^{\circ}$ Beam Scanning for Advanced Automotive Radars

Schmalenberg²,

Inac

et al. 2014

IEEE Trans. Microwave Theory Techn.

192

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A 16-element phased-array receiver has been developed for advanced W-band automotive radars. The phased-array receiver is based on a single SiGe chip with RF beamforming capabilities, which is packaged using low-cost bond-wire techniques and attached to a 16-element linear microstrip array. The antenna results in a directivity of 29.3 dB and a gain of 28.0 dB at 77-81 GHz, and can be scanned to 50 in the azimuth plane in 1 steps. The packaging details are presented together with the steps taken to ensure a wideband impedance match and low coupling between the phased-array channels. Gain measurements done at 79 GHz agree well with simulations. The 16-element phased array receiver was used with a 2-element frequency-modulated continuous-wave transmitter at 76.5-77 GHz and high-resolution millimeter-wave images were obtained. The work shows that complex millimeter-wave phased arrays can be packaged using traditional bond-wire techniques, and can be a powerful solution for advanced automotive radars.

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“…특히 과거 X/Ku/Ka band 대역의 군사 및 위성 통신시스템에 적용되 어 왔던 위상 배열 시스템이 60 GHz 대역의 통신 시스템 이나 [1] 77 GHz 대역의 차량용 레이더 시스템 [2] 과 같은 상 용제품에 적용되면서, 대량 생산을 위한 실리콘 기반 RFIC Fig. 2.…”

Section: 실리콘 기반의 소자 기술이 급속도로 발전함에 따라 과거 ⅲ～ⅴ 화합물 소자를 이용하여 구현하였던 회로를unclassified

Silicon Based Millimeter-Wave Phased Array System

Kang¹

2014

The Journal of Korean Institute of Electromagnetic Engineering

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This paper reviews the research on silicon based phased array system operating from microwave to millimeter wave frequencies. First, the design of phase shifter using CMOS technology is presented. The passive phase shifter is applied to the transmit/receive module from one to 16 channel in a single chip. The 35 GHz 4-element T/R module consumes less than 200 mW both transmit and receive modes. The architecture can extend to 16-channel operating at 44 GHz, thereby improving transmit power and linearity. The Ku-band 2-antenna 4-element receiver was developed using active phase shifter based on vector sum method. It is important to minimize coupling between beams because the chip contains four independent beams. The method of coupling is presented and verified.Key

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A CMOS Bidirectional 32-Element Phased-Array Transceiver at 60 GHz With LTCC Antenna

Cited by 136 publications

References 21 publications

Investigation of a photodefinable glass substrate for millimeter-wave radios on package

Investigation of a photodefinable glass substrate for millimeter-wave radios on package

A 77–81-GHz 16-Element Phased-Array Receiver With $\pm {\hbox{50}}^{\circ}$ Beam Scanning for Advanced Automotive Radars

Silicon Based Millimeter-Wave Phased Array System

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