A compact PA MMIC module for K-band high-speed wireless systems

Satoh, T.; Ichikawa, Satoshi; Betti-Berutto, A.; Poledrelli, C.; Furukawa, Y.; Hasegawa, Yohei; Kuroda, S.; Fukaya, J.

doi:10.1109/mwsym.2000.861766

Cited by 10 publications

(5 citation statements)

References 5 publications

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“…The matching circuits in each MMIC are designed by using distributed small signal FET models as well as large signal impedance optimum active source load pull data generated through measurements. [2] 4. MMIC MODULE These MMICs are mounted in a newly developed package.…”

Section: Mmic Caracteristicsmentioning

confidence: 99%

A Gate Bias Free Power MMIC Module for Ka-Band High-speed Wireless Applications

Ichikawa

Satoh

Betti-Berutto

et al. 2000

30th European Microwave Conference, 2000

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A high power and high gain packaged power MMIC module for Ka-band applications operating under a single polarity bias supply has been developed for the first time. This PA module consists of two pseudomorphic HEMT MMICs, with Lg=0.25um, packaged in a single power module. These MMICs operate without a gate bias control voltage when the gate bias is shunted in the package. This PA module provides 30dBm output power and approximately 30dB of gain in the 27-31GHz range. The single bias supply operation provides significant cost advantage to the device manufacture as well as the end user since there is no need to design a gate control bias network.

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Section: Mmic Caracteristicsmentioning

confidence: 99%

A Gate Bias Free Power MMIC Module for Ka-Band High-speed Wireless Applications

Ichikawa

Satoh

Betti-Berutto

et al. 2000

30th European Microwave Conference, 2000

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“…Several efficiency enhancement techniques such as envelope elimination and restoration (EER), envelope tracking (ET) and Doherty have been developed in lower microwave frequency bands [1][2] but this subject has not paid much attention in mmw frequencies. The efficiency of conventional mmw power amplifiers is less than 35 percent in the best case [3][4][5][6]. There is therefore a need to investigate some design methods to improve efficiency for mmw PAs.…”

Section: Introductionmentioning

confidence: 99%

A 28 GHz linear envelope tracking-power amplifier for LMDS applications

Roodaki

Mohammadi

Abdipour

et al. 2011

2011 International Conference on Electrical and Control Engineering

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This paper presents the design and simulation of an envelope tracking power amplifier (ET-PA) for 28 GHz LMDS applications. A linearization algorithm is also employed in digital domain in order to reduce the distortion of the system. Simulation shows that proposed ET-PA delivers 19dBm output power with 21dB linear gain. Power added efficiency of this amplifier is more than 41% which shows about 15 percent efficiency enhancement compared to conventional LMDS PAs.

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“…In order to properly accommodate customers' on the premises equipment or personal mobile terminals for Ka-band wireless systems, compact integration of the microwave circuits (especially the power amplifier) with the internally matched surface mounting structure (developed by surface mounting technology, or SMT) is a key issue. However, most typical Ka-band power-amplifier modules have not been constructed using SMT [1][2]. Although a few power-amplifier modules have been designed as SMT structures, they do not include matching circuits to internally compensate for possible mismatching caused by interconnection vias or bonding wires [3].…”

Section: Introductionmentioning

confidence: 99%

“…To achieve impedance matching, those typical modules need to have external matching networks. Recently, multi-layer low-temperature co-fired ceramic (LTCC) technology has attracted attention for Ka-band power amplifier integration, due to its low-resistance metallization, excellent high-frequency characteristics, 3D integration capability, small temperature-coefficient-of-expansion value (compatible with semiconductors), and cost effectiveness, as well as its capability of multilayer circuit integration, which enables impedance transformation within the block [4][5]. We devise a compact SMT-compatible LTCC power-amplifier module with internal matching networks of 22-dBm output power for Ka-band wireless communication terminals.…”

Section: Introductionmentioning

confidence: 99%

A Ka‐band LTCC integrated 22‐dBm MMIC power‐amplifier module

Kim¹,

Yoon

Park³

2003

Micro & Optical Tech Letters

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This paper describes the design and fabrication of a 0.7‐mm‐thick compact Ka‐band low‐temperature co‐fired ceramic (LTCC) power‐amplifier module, integrating the 0.25‐μm PHEMT MMIC power‐amplifier design. The LTCC module, designed for a surface‐mounting structure, and composed of a five‐layer LTCC circuit with internal matching networks. The power‐amplifier module reveals 24‐dBm output power and 8‐dB power gain between 28 and 31 GHz, which is equivalent to less than 1 dB loss compared to the MMIC's performance. © 2003 Wiley Periodicals, Inc. Microwave Opt Technol Lett 38: 455–457, 2003; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.11088

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A compact PA MMIC module for K-band high-speed wireless systems

Cited by 10 publications

References 5 publications

A Gate Bias Free Power MMIC Module for Ka-Band High-speed Wireless Applications

A Gate Bias Free Power MMIC Module for Ka-Band High-speed Wireless Applications

A 28 GHz linear envelope tracking-power amplifier for LMDS applications

A Ka‐band LTCC integrated 22‐dBm MMIC power‐amplifier module

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