1993
DOI: 10.1002/amo.860020403
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A comparative investigation of the oxidation of silicon using H2/O2, TCA/O2 and HCl/O2 mixtures

Abstract: The oxidation of single-crystal silicon wafers has been investigated using an industrial thermal oxidation system. The growth characteristics and electrical properties of the oxides resulting from pure hydrogen/ oxygen ( H2/ 02), t richloroet hane/ oxygen (TCA/ 0 2 ) and hydrogen chloride/oxygen (HC1/02) mixtures have been investigated and compared. The addition of both HCI and TCA to oxygen produces higher growth rates and improved electrical characteristics. It is shown that the oxidation rate for TCA/02 is … Show more

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“…32 For the convex cylindrical geometry, compressive stresses normal to the Si/ SiO 2 interface and tensile stresses tangential to the circumference of the SiNW develop during oxidation as a result of the volume expansion of the newly formed oxide. 33,34 In addition to accelerating SiNW oxidation, discernable differences are also observed in the electrical properties of top-gated FETs fabricated using SiNWs oxidized with TCA, as described below. For SiNWs with smaller d 0 and larger t ox,avg , this effect becomes increasingly important, resulting in a reduced oxidation rate of small-diameter SiNWs.…”
Section: Resultsmentioning
confidence: 99%
“…32 For the convex cylindrical geometry, compressive stresses normal to the Si/ SiO 2 interface and tensile stresses tangential to the circumference of the SiNW develop during oxidation as a result of the volume expansion of the newly formed oxide. 33,34 In addition to accelerating SiNW oxidation, discernable differences are also observed in the electrical properties of top-gated FETs fabricated using SiNWs oxidized with TCA, as described below. For SiNWs with smaller d 0 and larger t ox,avg , this effect becomes increasingly important, resulting in a reduced oxidation rate of small-diameter SiNWs.…”
Section: Resultsmentioning
confidence: 99%