2022
DOI: 10.1109/lemcpa.2022.3163963
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A Comparative Performance Analysis of 6T & 9T SRAM Integrated Circuits: SOI vs. Bulk

Abstract: This paper evaluates the performance of 6T & 9T static random access memory (SRAM) cells, for data stability and power metrics, with the aim to compare silicon-on-insulator (SOI) and bulk CMOS technologies. Each SRAM topology was designed & simulated in 180 nm 5 V XFAB-SOI and AMS-bulk processes, using optimized parameters and compatible devices. The fundamental variables analyzed were read noise margins, write trip current & voltage as well as leakage current (LC) and static power dissipation (SPD) under proc… Show more

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Cited by 6 publications
(2 citation statements)
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“…Thus, we have incorporated above said doping profiles for NS-FET. The proposed NS-FET is adopted with silicon-on-insulator (SOI) technology which improves electrostatics, near ideal subthreshold characteristics, minimizes parasitic capacitances, less power consumption and suppressed threshold voltage (Vth) variations [23]. The Genius 3D TCAD simulator by Cogenda [24], is used for the generation and simulation of the JL and INV mode NS-FET structures.…”
Section: Device Description and Simulation Methodologymentioning
confidence: 99%
“…Thus, we have incorporated above said doping profiles for NS-FET. The proposed NS-FET is adopted with silicon-on-insulator (SOI) technology which improves electrostatics, near ideal subthreshold characteristics, minimizes parasitic capacitances, less power consumption and suppressed threshold voltage (Vth) variations [23]. The Genius 3D TCAD simulator by Cogenda [24], is used for the generation and simulation of the JL and INV mode NS-FET structures.…”
Section: Device Description and Simulation Methodologymentioning
confidence: 99%
“…To see the dependence of the output frequency on temperature, the latter was increased from −40 °C to 120 °C with 5 °C step size and an accuracy of ±1 °C. Although the IC developed in SOI can withstand temperatures up to 175 °C compared to the conventional bulk CMOS technology [37], the mentioned range was selected as it complies with the temperature limit of all the components soldered on the PCB.…”
Section: Effect Of Temperature Variation On the Integrated Oscillatorsmentioning
confidence: 99%